WMSIC Electronic Components

ON FOD817A3SD

ModelFOD817A3SD
PackageSMD-4P
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON FOD817A3SD
Type
ON
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
FOD817A3SD
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.549g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0000035103
Operating Temperature
55℃~+110℃
Load Voltage
70V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FOD817A3SD 产品概述

简介

FOD817A3SD 是安森美(ON Semiconductor)推出的一款高性能光耦合器,属于晶体管输出光耦系列。这款产品广泛应用于各种电气隔离和信号传输场合,尤其适合于需要高电压和高隔离等级的电路设计。FOD817A3SD 凭借其卓越的性能参数,如高电压隔离、高传输比,以及适配广泛工作温度范围,成为电子工程师的极佳选择。

基本参数

FOD817A3SD 具有单通道设计,支持5000Vrms的电压隔离,能够有效防止不同电位间的干扰,守护电路的安全与稳定。其电流传输比(CTR)在典型情况下为80%至160%(在5mA 输入条件下),使其在各种负载下均能够提供可靠的工作性能。上升时间和下降时间典型值分别为4μs和3μs,保证了在快速开关应用中的响应速度。

输出特性

该光耦的输出部分采用晶体管结构,允许最大输出电压为70V,输出电流可达每通道50mA。这使得 FOD817A3SD 在驱动负载方面具有良好的能力,尤其适合于串联负载,如继电器和灯等。在正向电压方面,典型值为1.2V,考虑到最大正向电流为50mA,为设备的设计和使用提供了灵活性。

功能与应用

FOD817A3SD 适合的应用场景包括但不限于:

  • 隔离放大器电路
  • 继电器驱动
  • 数字逻辑之间的电信号隔离
  • 工控设备和嵌入式控制系统
  • 电源管理和保护电路

该光耦的设计还考虑到了散热和电流传导的效率,其饱和压降(Vce)最大为200mV,这意味着在 50mA 的输出条件下,光耦能有效降低功耗和发热,有助于延长产品的使用寿命。

工作温度与封装

FOD817A3SD 的工作温度范围广泛,从低至-55°C到最高110°C,使其在各种苛刻环境下都可以稳定工作。此外,采用表面贴装型的4-SMD封装,不仅具有良好的空间利用率,也支持快速便捷的PCB组装,适合当今高度集成的小型化电子设备设计需求。

结论

总之,FOD817A3SD晶体管输出光耦以其优越的电气参数、广泛的应用场景及卓越的隔离能力,无疑是设计工程师在构建安全有效的电路时不可忽视的重要元器件之一。通过选择 FOD817A3SD,设计人员不仅能提高产品的安全可靠性,还能有效提升系统的整体性能。无论是在消费类电子、工业设备还是通信领域的应用,FOD817A3SD 都能为系统设计提供坚实的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.