Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON MB6S
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON MB6S
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MB6S
- Electronic Component
- 1
- Package
- SOIC-4
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.242g
- Electronic Component
- 1
- Electronic Component
- BM0228538919
- Current
- 500mA
- Current(Ir)
- 5uA@600V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB6S 单相整流桥（ON / 安森美） 产品概述
一、概述
MB6S 是一款面向小功率交流到直流整流的单相桥式整流器，ON（安森美）品牌出品。器件额定整流电流为 500mA，反向耐压高达 600V，适用于高压、低电流场景的整流与保护电路。器件采用 SOIC-4 封装，体积小、便于 PCB 布局与自动贴片加工。
二、主要电气参数
- 工作结温度范围：-55℃ 至 +150℃，适应宽温区应用。
- 额定整流电流：500mA（连续直流整流）。
- 正向压降（Vf）：约 1.0V @ 500mA（典型值，实际请参考曲线）。
- 反向直流耐压（Vr）：600V，可用于高压整流或峰值电压较高的电源输入侧。
- 反向漏电流（Ir）：5μA @ 600V（典型条件下），利于低泄漏电流设计需求。
- 非重复峰值浪涌电流（Ifsm）：35A（一次性浪涌能力，用于吸收开机或短时浪涌）。
- 类型：单相桥式整流（两交流端、正极、负极）。
三、封装与热特性
- 封装：SOIC-4（表面贴装），适合自动化生产与高密度布板。
- 由于额定整流电流较小，器件功耗和发热较低，但在高温或大负载短路条件下需关注结温上升。建议在 PCB 设计中为器件提供适当的铜箔散热、短走线及旁路电容，以降低结温并提高可靠性。
四、典型应用
- 小功率开关电源的整流与二次侧供电。
- 家电与工业设备中高压低电流电源模块。
- 测试与测量仪器的高压前端整流。
- 信号隔离电源、LED 驱动（小电流场合）和电池充电管理的部分场景。
五、设计与使用注意事项
- 正向压降在 500mA 时约为 1V，设计中应考虑整流损耗与对应的热量。
- Ifsm 为非重复峰值浪涌能力，不作为频繁过载使用的依据，若存在频繁浪涌需选用更高浪涌等级或并联/使用更大器件。
- 在高压应用下，布板需保证足够的爬电距离与绝缘间隙，以防击穿或漏电。
- 推荐在整流输出并联适当的电解或陶瓷滤波电容，改善纹波与瞬态响应。
- 焊接与回流工艺应遵循封装厂商的温度规范，避免超温导致封装或引脚应力损伤。
六、选型与替代建议
MB6S 适合 600V 级、500mA 的整流需求。若需要更高电流或更低正向压降，可考虑更大电流等级或肖特基整流器；若对漏电流或反向恢复时间有更严格要求，可选用专用低漏/快恢复器件。购买时请参考 ON 官方案例与完整数据手册以确认曲线与封装细节。
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