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ON NCP114AMX260TCG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ON NCP114AMX260TCG
- Type
- ON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- 70uVrms
- Electronic Component
- NCP114AMX260TCG
- Electronic Component
- 1
- Package
- UDFN-4(1.0x1.0)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0264552533
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 5.5V
- Output
- Electronic Component
- Output Voltage
- 2.6V
- Output Current
- 300mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NCP114AMX260TCG 产品概述
一、器件简介
NCP114AMX260TCG 是 ON Semiconductor 推出的固定输出线性稳压器（LDO），输出电压 2.6V，最大输出电流 300mA。器件采用紧凑的 UDFN-4（1.0 × 1.0 mm）封装，面向对尺寸、噪声和待机功耗有较高要求的便携与嵌入式应用。
二、主要电气特性
- 最大工作电压：5.5V（器件额定的输入电压上限，请设计时参考数据手册）
- 输出电压：固定 2.6V
- 最大输出电流：300mA
- 静态电流（Iq）：50 μA（典型低静态电流，适合电池供电系统）
- 噪声：70 μVrms（低输出噪声，利于模拟与射频前端）
- PSRR：75 dB @ 1 kHz（良好的电源纹波抑制）
三、功能与保护
器件集成一系列实用功能：使能控制（EN），输出放电功能（在禁止时主动将输出拉低），过流保护、短路保护以及热关断（防止过温损坏）。这些保护机制可提升系统可靠性并简化外围电路设计。
四、封装与热管理
UDFN-4（1.0×1.0 mm）超小封装有利于高密度系统设计，但散热能力有限。设计时需关注功耗与结温：
- 功耗计算：Pd = (Vin - Vout) × Iout。举例：若 Vin = 5.5V，Vout = 2.6V，Iout = 300 mA，则 Pd ≈ 0.87 W，需评估封装的热阻与系统散热能力。
- 推荐在 PCB 布局中使用焊盘与多层铜箔散热路径，尽量增大热流通道并靠近地平面扩展散热。
五、典型应用场景
适用于对噪声和纹波敏感的电路及低功耗系统，包括但不限于：便携设备电源轨、传感器/模拟前端、低速数字电路电源、物联网终端及电池供电模块的降压后级稳压。
六、设计与布局建议
- 输入与输出电容应靠近器件管脚放置，遵循数据手册对电容容量与 ESR 的推荐，以保证稳定性与瞬态响应。
- EN（使能）控制引脚用于系统电源域管理，逻辑电平阈值及上拉/下拉电路请参考器件手册。
- 在高压差或大电流应用中评估功耗并做好热设计，必要时通过降低工作电流、增加散热或选择功耗更低/封装更大器件来解决。
- 具体引脚排列、启用门槛、电容规格、布局示例以 ON Semiconductor 数据手册为准。
七、选型注意事项
NCP114AMX260TCG 以小体积、低静态电流与良好纹波抑制为主要卖点。选型时请确认系统最大输入电压、允许功耗与热裕量，以及是否需要外部输出调整（本器件为固定 2.6V）。如需不同输出电压、或更高输出电流/更强散热能力，可考虑系列中其它封装或规格的型号。
如需进一步导入到具体原理图与 PCB，请提供工作电压范围、最大负载及散热约束，我可以给出更详细的布线与外围元件建议。
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