WMSIC Electronic Components

ON MMBF4391LT1G

ModelMMBF4391LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBF4391LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBF4391LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET(JFET)
Electronic Component
0.03g
FETType
N
Electronic Component
1
Electronic Component
BM0058432060
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBF4391LT1G 产品概述

1. 产品简介

MMBF4391LT1G是一款高性能的N通道结型场效应管(JFET),由知名半导体制造商安森美(ON Semiconductor)推出。该器件采用小型SOT-23-3(TO-236)封装,适合各种表面贴装应用,具备占用空间小和重量轻的优势。其主要特点包括较高的电压击穿和功率处理能力,适合在多个电子电路中使用,例如信号放大、开关电路和模拟电路。

2. 关键参数

2.1 电气特性

  • 类型: N通道JFET
  • 击穿电压 (V(BR)GSS): 30V
  • 漏源电压 (Vds): 30V
  • 漏极电流 (Idss): 在Vgs = 0时,Id可达50mA(在15V时测得)
  • 截止电压 (VGS off): 4V @ 10nA,展现了该器件在关断状态下的精确性
  • 输入电容 (Ciss): 最大值为14pF @ 15V,适合高频应用

2.2 热特性

  • 工作温度范围: -55°C ~ 150°C,适合极端环境下的应用
  • 最大功率: 225mW,能够处理多种中低功率电路负载

2.3 封装和安装

  • 封装类型: SOT-23-3(TO-236),小型化设计,方便布局,并适配自动化贴装设备
  • 安装方式: 表面贴装(SMD),便于现代电路板制造和批量生产

3. 应用场景

MMBF4391LT1G的设计使其适用于广泛的应用场景,包括但不限于:

  • 信号放大: 由于其高输入阻抗和较低的输入电容,适合在需要最小化信号损失的放大电路中使用。
  • 开关电路: 能够在较高电压条件下安全切换,适合用作开关元件。
  • 模拟电路: 可用于模拟信号处理,比如在音频或射频电路中的应用。
  • 高温环境应用: 凭借其广泛的工作温度范围,适用于航空航天、汽车电子及工业控制等高温环境下的电路设计。

4. 设计考虑

在设计使用MMBF4391LT1G的电路时,需要考虑以下因素:

  • 散热要求: 尽管其功率处理能力为225mW,但在高负载条件下仍需考虑适当的散热设计,以保障器件的可靠性与稳定性。
  • 布线与布局: 由于其小型封装,高频应用时需要注意PCB的布线设计,以避免引入不必要的串扰和寄生电容。
  • 安全电压和电流限制: 在实际应用中,不应超过其最大工作参数,以确保器件的正常运行和长寿命。

5. 总结

作为一款具有高性能特性的结型场效应管,MMBF4391LT1G能够满足现代电子设备的多种需求。它的小型化设计以及卓越的电气特性使其成为信号放大、开关电路和模拟处理等多种应用中的理想选择。特定环境条件下的高温工作能力和广泛的应用场景,使得该器件在消费类电子、工业控制以及先进的通信系统中均能展现其卓越的性能。

综上所述,MMBF4391LT1G无疑是一款值得关注的高可靠性元器件,适合大多数电子产品设计需要,是工程师在选择场效应管时的一项理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.