Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称: BC856BM3T5G
品牌: ON Semiconductor (安森美)
类型: PNP 晶体管
封装类型: SOT-723
BC856BM3T5G 是一款高性能的 PNP 型双极性晶体管(BJT),专为各种电子应用而设计。由于其卓越的电气性能和宽广的工作温度范围,这款晶体管在低功耗、高频和低噪音的电子电路中表现出色。其紧凑的 SOT-723 封装使其适合表面贴装技术(SMT),在现代电子产品的小型化趋势下尤为受欢迎。
BC856BM3T5G 的关键电气参数如下:
BC856BM3T5G 的直流电流增益 (hFE) 在220以上 @ 2mA, 5V这表明其在常规操作下具有良好的增益特性。高hFE值意味着在较小的基极电流下能够控制较大的集电极电流,使其在放大和开关应用中表现出色。
BC856BM3T5G 被广泛应用于多种电子产品中,包括:
作为一款表面贴装型晶体管,BC856BM3T5G 采用 SOT-723 封装,其小体积和轻量化设计非常理想,适合自动化生产线的贴装工艺。这种封装形式使得在电子设备中进行空间优化成为可能,同时也降低了PCB的整体重量。
BC856BM3T5G PNP 晶体管是安森美推出的一款性能均衡的器件,凭借其高可靠性和优异的电气特性,能够满足现代电子设备对小型化、高效能和复杂性的需求。对于设计师而言,BC856BM3T5G 是实现各种低功耗、高增益和高频应用的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products