WMSIC Electronic Components

ON BAT43XV2

ModelBAT43XV2
PackageSOD-523F
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON BAT43XV2
Type
ON
Unit
Electronic Component
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
BAT43XV2
Electronic Component
1
Package
SOD-523F
Electronic Component
Schottky Diode
Electronic Component
0.006g
Electronic Component
1
Electronic Component
BM0265086610
Current
200mA
Diode
1
Current(Ir)
500nA@25V
Electronic Component
Electronic Component
Electronic Component
8000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT43XV2 产品概述

一、产品简介

BAT43XV2 是安森美(ON Semiconductor)推出的一款肖特基整流二极管,面向便携式和高密度电路板应用。器件为独立式单颗二极管,采用超小型表面贴装封装 SOD-523F,具备低正向压降、快速开关和较低反向漏电流等特点,适合用于低电压、高频切换和电源保护场合。

二、关键电气参数

  • 正向压降 (Vf):1 V @ 0.2 A(典型测试点),低压降有利于降低功耗和发热。
  • 直流反向耐压 (Vr):30 V,支持常见单节/多节电池与低压电源轨保护。
  • 正向整流电流 (If):200 mA 连续工作能力,满足小电流供电路径需求。
  • 非重复峰值浪涌电流 (Ifsm):4 A(一次性脉冲),用于吸收瞬态浪涌或短时冲击电流(请按脉冲宽度和热限制使用)。
  • 反向电流 (Ir):500 nA @ 25 V,低反向漏电适合电池供电和待机功耗敏感的应用。

三、封装与机械特性

封装:SOD-523F,超小型贴片封装,适配高密度 PCB 设计。
极性识别:器件常在一侧有阴极带或印记,便于自动贴片识别与焊接定位。
由于封装尺寸受限,热阻相对较高,器件的平均功率耗散受 PCB 铜箔面积与散热路径影响明显。

四、优势与典型应用

优势:

  • 低正向压降,降低导通损耗和功率消耗;
  • 快速恢复/开关特性,适合高频整流与信号检测;
  • 低反向漏电流,利于延长电池待机时间;
  • 极小封装,适用于体积受限的消费电子。

典型应用场景:

  • 电源反极性保护与肖特基 OR’ing;
  • 小电流整流与同步整流辅助;
  • 信号钳位、检波器和快速开关电路;
  • 移动设备、蓝牙/IoT 模块、传感器前端以及便携式仪表的低功耗电路。

五、设计与布局建议

  • 热管理:在需要靠近较高电流路径时,建议在 PCB 上扩大焊盘和铜箔面积以提升散热能力;考虑与底层铜平铺相连以降低热阻。
  • 串联/并联使用:若需提升连续电流能力,应采用并联或选择更大封装器件;峰值浪涌能力仅限一次性短时脉冲,不适合反复冲击场合。
  • 极性注意:在布局与丝印上标注阴极方向,防止贴装翻转导致电路损坏。
  • 滤波与抑制:在开关场合配合小电容或 RC 抑制网络可改善振铃与 EMI 行为。

六、可靠性与焊接注意事项

  • 焊接工艺:器件适用于无铅回流焊工艺,请遵循制造商推荐的温度曲线,避免过高峰值温度及超时回流。
  • 存储与处理:防止潮湿吸收导致焊接缺陷,建议按等级储存并在规定时间内回流。
  • 可靠性:避免超过额定反向电压与额定正向电流的长期工作;Ifsm 为非重复峰值指标,设计时留有裕量以保证长期可靠性。

总结:BAT43XV2 以其低 Vf、低 Ir 和超小 SOD-523F 封装,在便携与高密度电路中提供了一种高性价比的肖特基二极管解决方案。选择时应综合考虑连续电流、浪涌容限与散热布局,以确保长期稳定运行。

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