WMSIC Electronic Components

ON BSS138LT3G

ModelBSS138LT3G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON BSS138LT3G
Type
ON
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
BSS138LT3G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0058413590
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS138LT3G 产品概述

概览

BSS138LT3G 是一种高性能、低功耗的 N 通道 MOSFET(场效应管),由安森美(ON Semiconductor)制造。该器件专为需要较高开关速度和良好电流控制的应用场景设计,广泛应用于智能手机、平板电脑、便携式设备、以及其他需要节能高效性能的电子产品。其采用 SOT-23-3(TO-236)封装,适合表面贴装技术(SMT),便于大规模生产和集成。

关键电气参数

  1. 漏源电压 (Vdss): BSS138LT3G 具有最大 50V 的漏源电压,适用于多种电源管理和信号开关应用。高漏源电压确保在各种工作条件下的可靠性。

  2. 连续漏极电流 (Id): 器件可以承受最大 200mA 的连续漏极电流(在 25°C 时),确保其在高负荷条件下依旧稳定工作。

  3. 导通电阻 (Rds On): 在 Vgs 为 5V 的条件下,BSS138LT3G 的最大导通电阻为 3.5Ω,这在一定程度上降低了功率损耗,提高了效率。

  4. 阈值电压 (Vgs(th)): 最大阈值电压为 1.5V@1mA,有利于在低电压信号下实现快速开关,从而提升设计灵活性。

  5. 输入电容 (Ciss): 在 25V 下,其输入电容的最大值为 50pF,这使得器件在高频应用中具有良好的性能,能够快速响应输入信号。

  6. 功率耗散 (Pd): 在 25°C 的环境下,BSS138LT3G 的最大功率耗散达 225mW,适合在要求较小功率损耗的应用场景中使用。

工作条件与特性

BSS138LT3G 的工作温度范围广,能够在 -55°C 至 +150°C 的环境中稳定运行。这使得该 MOSFET 在极端环境下的電子应用中表现出色,如汽车电子、航空航天设备和工业控制系统。

该器件采用表面贴装型设计,使其在电路板的空间利用上达到最优化,非常适合现代小型化、高密度布局的趋势。此外,封装选用 SOT-23-3(TO-236)形式,使设备的散热效率和生产效率达到较高水平。

应用场景

BSS138LT3G 被广泛应用于以下领域:

  • 电源管理: 用于开关电源和电流控制电路,能够实现高效的能量转化。
  • 电信设备: 在信号切换、调制解调器和其他通信模块中起到至关重要作用。
  • 消费电子: 像智能手机、平板电脑等便携式设备中用于电源开关、负载驱动等功能。
  • 传感器接口: MOSFET 的灵活性使其能够作为低电流信号的开关,有助于实现传感器与处理器间的无缝连接。

结论

综上所述,BSS138LT3G 是一款性能卓越的 N 通道 MOSFET,具有适合多种应用的电气特性和良好的工作温度范围。其低功耗、高速度和广泛的适用性使其成为现代电子设计中不可或缺的元件。无论是在便携设备、工业控制还是通信系统中,BSS138LT3G 都是实现高性能和高能效的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.