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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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MMSZ10T1G 为安森美(ON Semiconductor)推出的表面贴装型齐纳二极管,标称稳压值 10V,容差 ±5%(稳压范围 9.5V–10.5V),最大耗散功率 500mW。器件采用 SOD-123 小型封装,适合自动贴片与高密度 PCB 设计,常用于电压基准、浪涌吸收与电路保护等场景。
该器件具有低漏电、适中动态阻抗的特点,适合低功耗、小信号电路的稳压或保护用途。由于最大耗散仅 500mW,建议在实际应用中保持稳压二极管的平均电流远低于 Iz_max,以降低结温并延长寿命。动态阻抗 20Ω 表明在较大电流变化时稳压值会出现明显漂移,要求较稳定电压输出时需配合合适的稳流及滤波设计。
常见的齐纳稳压为并联(分流)型:在 Vin 与负载之间串联限流电阻 R,然后并联 MMSZ10T1G 到地。计算参考:
SOD-123 封装适用于回流焊接与自动贴装。焊接时遵循管脚温度与回流曲线规范,避免过长或过高的温度暴露。布板时为减小结温应在焊盘处提供适量铜箔散热,并尽量避免长期在高环境温度下满载工作。
总结:MMSZ10T1G 为一款适合小功率稳压与保护用途的 10V 齐纳二极管,SOD-123 封装便于表面贴装,性能在低功耗与小型化设计中具有较高实用性。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
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