WMSIC Electronic Components

ON MMSZ10T1G

ModelMMSZ10T1G
PackageSOD-123
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON MMSZ10T1G
Type
ON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMSZ10T1G
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.035g
Electronic Component
1
(Zzt)
20Ω
Electronic Component
BM0228538911
Diode
1
Current(Ir)
200nA@7V
Power Dissipation(Pd)
500mW
Electronic Component
9.5V~10.5V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ10T1G — 10V/500mW SOD-123 表面贴装齐纳二极管(ON/安森美)

一、产品概述

MMSZ10T1G 为安森美(ON Semiconductor)推出的表面贴装型齐纳二极管,标称稳压值 10V,容差 ±5%(稳压范围 9.5V–10.5V),最大耗散功率 500mW。器件采用 SOD-123 小型封装,适合自动贴片与高密度 PCB 设计,常用于电压基准、浪涌吸收与电路保护等场景。

二、主要技术参数

  • 标称稳压值 Vz:10V(范围 9.5V–10.5V,±5%)
  • 反向漏电流 Ir:200nA @ 7V
  • 动态阻抗 Zzt:20Ω(典型)
  • 最大功耗 Pd:500mW
  • 最大稳压电流(理论):Iz_max = Pd / Vz = 0.5W / 10V = 50mA
  • 工作结温范围 Tj:-55°C ~ +150°C
  • 封装:SOD-123(表面贴装)

三、关键性能与使用建议

该器件具有低漏电、适中动态阻抗的特点,适合低功耗、小信号电路的稳压或保护用途。由于最大耗散仅 500mW,建议在实际应用中保持稳压二极管的平均电流远低于 Iz_max,以降低结温并延长寿命。动态阻抗 20Ω 表明在较大电流变化时稳压值会出现明显漂移,要求较稳定电压输出时需配合合适的稳流及滤波设计。

四、典型应用场景

  • 低速或低功耗电路的局部参考电压源
  • 输入过压或反向保护、瞬态钳位
  • ADC/DAC 参考、偏置电路
  • 通信设备与工业控制中小功率稳压与保护

五、简单选型与电路示例

常见的齐纳稳压为并联(分流)型:在 Vin 与负载之间串联限流电阻 R,然后并联 MMSZ10T1G 到地。计算参考:

  • 所需电阻 R = (Vin - Vz) / Iz
  • 考虑最大耗散时 Iz 不应超过 50mA,且实际工作电流通常选择在 1–10mA 区间以降低热应力与噪声。 示例:若 Vin = 15V,希望 Iz = 10mA,则 R = (15 - 10) / 0.01 = 500Ω;R 的功耗 P_R = (Vin - Vz) * Iz = 5V * 10mA = 50mW。

六、封装与焊接

SOD-123 封装适用于回流焊接与自动贴装。焊接时遵循管脚温度与回流曲线规范,避免过长或过高的温度暴露。布板时为减小结温应在焊盘处提供适量铜箔散热,并尽量避免长期在高环境温度下满载工作。

七、注意事项

  • 在高温或连续大电流条件下需降额使用,避免长期靠近最大 Pd 工作。
  • 动态阻抗会导致稳压随电流变化,精密参考场合需配合稳流源或后端放大电路。
  • 荷载开关瞬态可能引起电压摆动或冲击,应评估浪涌能力并视需要增加限流或吸收元件。

总结:MMSZ10T1G 为一款适合小功率稳压与保护用途的 10V 齐纳二极管,SOD-123 封装便于表面贴装,性能在低功耗与小型化设计中具有较高实用性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.