WMSIC Electronic Components

ON 2N3904BU

Model2N3904BU
PackageTO-92
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON 2N3904BU
Type
ON
Minimum package
10000

Technical parameters

Electronic Component
ON
Electronic Component
2N3904BU
Electronic Component
1
Package
TO-92
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.21g
Electronic Component
1
Electronic Component
BM0209589490
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
625mW
Electronic Component
10000
Collector Current(Ic)
200mA
Current (h FE)
100

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N3904BU 产品概述

一、概述

2N3904BU 是 ON(安森美)出品的一款通用 NPN 小信号三极管,封装为 TO-92,适用于低功耗开关与小信号放大场合。器件强调低漏电、较宽的温度范围(-55℃ ~ +150℃)与良好的频率响应(fT ≈ 300MHz),在典型电子设计中被广泛采用,兼顾成本与性能。

二、主要参数(基于给定规格)

  • 晶体管类型:NPN,数量:1 个
  • 直流电流增益 hFE:100(在 Ic = 10mA、VCE = 1V 条件下)
  • 集电极电流 Ic(最大):200mA
  • 集电极-发射极击穿电压 Vceo:40V
  • 基-发射极击穿电压 Vebo:6V
  • 集电极截止电流 Icbo:50nA(小泄漏电流,有利于高阻电路)
  • 特征频率 fT:300MHz(适合高频小信号放大与快速开关)
  • 耗散功率 Pd:625mW(TO-92 封装,典型环境条件下)
  • 集-射极饱和电压 VCE(sat):约 200mV(典型值,低电压损耗)
  • 工作温度范围:-55℃ 至 +150℃
  • 封装:TO-92,品牌:ON(安森美)

三、电气特性解读

  • hFE = 100(在 10mA 条件下)意味着在中小电流区具有良好的增益,适合用作小信号放大器与缓冲器。但 hFE 会随 Ic、VCE 及温度变化,设计时应参考数据手册中的增益曲线并预留裕量。
  • fT ≈ 300MHz 表明器件在高频下仍有不错的增益裕度,适合用于 RF 前端的低增益放大、脉冲电路或高速开关。
  • Ic 最大 200mA 与 Pd 625mW 限定了瞬态或短时驱动能力,但不适宜长期在大电流或高功耗环境中工作,需注意降额设计。
  • 低 Icbo(50nA)使其在高阻输入或漏电敏感的电路中表现良好,减少偏置漂移与静态误差。
  • Vebo = 6V 要避免基-射极施加过高反向电压,以免损坏结。

四、典型应用场景

  • 通用开关:驱动小继电器、LED、光耦或作为逻辑电平的电平转换。
  • 小信号放大:前置放大、音频前级、交流耦合放大电路。
  • 模拟电路:电流镜、偏置电路、放大器的驱动级。
  • 高频/脉冲电路:低功耗的高频前端或脉冲驱动(受限于功耗与结温)。
  • 教学与原型:由于通用性和低成本,常用于实验板与教学设计。

五、使用及布局建议

  • 基极限流:使用适当的基极电阻以限制基极电流,防止过流及影响 hFE 测量。
  • 热管理:TO-92 封装的热阻较大,若工作在高 Ic 或高占空比条件下,应使用降额或外加散热措施,并尽量缩短 PCB 板上引脚到铜箔的热散路径。
  • PCB 布局:高频应用中应缩短信号路径、做好去耦、并避免长走线引入寄生电感与电容。
  • 保护措施:在有可能出现反向电压或尖峰的环境下,建议在基极或集电极采用保护二极管或 RC 抑制网络。

六、可靠性与环境适应

该器件工作温度范围宽(-55℃ ~ +150℃),适合工业级与部分严苛环境。设计时仍需考虑温度对 hFE、漏电流与 Pd 的影响,并按照制造商的热阻与降额曲线进行功耗计算以保证长期可靠性。

七、小结

2N3904BU 以其稳定的中等电流能力、较高的频率响应和低成本,在通用开关与小信号放大领域表现均衡。设计人员在选用时应关注功耗和热降额,并参考器件数据手册的完整曲线和典型测试条件,以确保电路在目标应用中的稳定与可靠。

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