WMSIC Electronic Components

ON MC74HC165ADR2G

ModelMC74HC165ADR2G
PackageSOIC-16
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MC74HC165ADR2G
Type
ON
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
to
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MC74HC165ADR2G
Electronic Component
1
Package
SOIC-16
Electronic Component
positions Register
Electronic Component
74HC
Electronic Component
0.318g
Electronic Component
1
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0264967396
Operating Temperature
55℃~+125℃
Operating Voltage
2V~6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC74HC165ADR2G 产品概述

一、产品简介

MC74HC165ADR2G 是一款高性能的 8 位移位寄存器,属于广泛应用的 74HC 系列逻辑芯片,由安森美半导体(ON Semiconductor)制造。该器件可以通过并行或串行方式进行数据传输,并可在 2V 到 6V 的电压范围内正常工作,具有广泛的应用适应性,可满足不同电源要求的电子设计。

二、基本特性

  • 逻辑类型:MC74HC165ADR2G 采用的是移位寄存器逻辑类型,这使得其在串行和并行数据处理方面具有极高的灵活性。用户可通过其特定的控制引脚选择所需的工作模式。

  • 输出类型:该芯片为补充型输出,提供更高的驱动能力,适合连接多个负载,确保数据传输的可靠性。

  • 元件数:每个封装包含一个移位寄存器,能够处理 8 位数据,这对于需要快速数据处理和存储的应用场景非常适合。

  • 供电电压:MC74HC165ADR2G 的工作电压范围为 2V 至 6V,支持多种电源配置,适配不同的电源环境,为设计者提供更多的灵活性。

  • 工作温度:其工作温度范围为 -55°C 至 125°C,使得该芯片适用于严苛环境的应用如汽车电子、军事设备和工业控制系统等。

  • 安装类型:本器件采用表面贴装技术(SMD)封装方式,有效提高了产品的集成度及自动化焊接的便利性。

  • 封装类型:采用 16-SOIC (0.154", 3.90mm 宽) 封装,具备较小的体积和合理的引脚间距,这为电路板设计提供了更大的灵活性,帮助设计师实现紧凑的布局。

三、功能应用

MC74HC165ADR2G 主要用于数据采集、存储和传输等应用场合。其并行/串行至串行的功能,特别适合需要将多个输入信号转换为串行信号的场合,例如:

  1. 传感器接口:可以将多个传感器的数据通过串行方式传输至微控制器或其他处理模块,减少了接口数量和布线复杂度,提高了系统的灵活性。

  2. 控制系统:在复杂的控制系统中,通过将多个控制信号串行化,简化了控制逻辑设计,便于实现多路控制及信号处理。

  3. 数据通信:在数字通信系统中,MC74HC165ADR2G 可以作为数据发送模块,实现数据的高效转发,支持高速数据传输的需求。

  4. 扩展 I/O 接口:在微控制器 I/O 数量有限的情况下,通过使用 MC74HC165ADR2G 可以有效扩展可用的输入输出接口,满足复杂的控制和通信需求。

四、设计优势

MC74HC165ADR2G 的设计考虑了现代电子设备的多个关键要求,包括高效率、低功耗和温度适应性。其补充型输出提供了更强的驱动能力,避免了大电流带来的信号失真,保证了数据通信的稳定性。此外,其广泛的电压范围和工作温度使得设计者能够在不同的应用环境中灵活使用,适合多种行业。

五、总结

综上所述,MC74HC165ADR2G 是一款集成度高、性能稳定的移位寄存器,广泛应用于数据采集、控制系统、通信及扩展 I/O 接口等场合。其出色的电气特性与广泛的工作环境适应性,使得该芯片在现代电子设计中扮演着至关重要的角色。对于需要灵活高效数据处理解决方案的电子工程师而言,MC74HC165ADR2G 是一个值得推荐的选择。

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