WMSIC Electronic Components

ON FUSB301TMX

ModelFUSB301TMX
PackageTMLP-10
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON FUSB301TMX
Type
ON
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
FUSB301TMX
Electronic Component
1
Package
TMLP-10
Electronic Component
USB Converter IC
Electronic Component
0.32g
Electronic Component
1
Features
Low Power
Electronic Component
BM0264335841
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
2.8V~5.5V
Operating Current
15uA
Electronic Component
Controller
Static Current
7uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FUSB301TMX 安森美USB Type-C转换芯片产品概述

FUSB301TMX是安森美(ON Semiconductor)推出的一款高集成度USB Type-C配置通道(CC)控制芯片,专为需要实现Type-C接口基础功能的电子设备设计。作为Type-C接口生态中的核心控制单元之一,该芯片聚焦于CC逻辑管理,以超小封装、低功耗和宽工作范围为核心优势,适配各类便携、工业及消费电子场景。

一、产品定位与核心功能

FUSB301TMX的核心定位是Type-C接口的轻量级CC控制器,不依赖复杂的电源交付(PD)协议栈,专注于实现Type-C接口的基础必备功能:

  1. 双重角色端口(DRP)支持:可自动检测连接设备的角色(电源输出Source或输入Sink),无需手动配置,适配“双向充电”或“数据传输”场景;
  2. CC引脚逻辑管理:通过CC1/CC2引脚实现接口极性自动翻转(Type-C不分正反插入),同时支持Vconn电源的使能/禁用控制(为CC线提供供电);
  3. 状态检测与反馈:实时监测CC线的电压/电流状态,向系统MCU反馈接口连接状态(插入/拔出、角色变化),简化上层软件设计。

该芯片无需外部晶振,仅需少量被动元件即可工作,降低了BOM成本与电路复杂度。

二、关键电气参数解析

FUSB301TMX的电气参数针对电池供电与宽环境需求优化,核心参数及意义如下:

  • 工作电压范围:2.8V~5.5V,覆盖3.3V(常见MCU电源)、5V(USB标准电压)等主流电源轨,无需电平转换电路,直接兼容系统电源;
  • 工作温度范围:-40℃~+85℃(Ta),达到工业级温度标准,可稳定运行于户外、车间等温差较大的环境;
  • 功耗表现:工作电流典型值15uA(动态控制时),静态电流仅7uA(待机模式)——这是其核心优势之一,待机状态下几乎不消耗系统电量,显著延长电池设备续航(例如智能手表待机时可减少约30%额外功耗);
  • CC引脚特性:支持最高5.5V的CC线电压,兼容Type-C接口的电压规范,避免过压损坏。

三、封装与物理特性

FUSB301TMX采用TMLP-10封装(尺寸1.2mm×1.6mm×0.5mm),属于超小型薄型封装,具有以下特点:

  1. 超小尺寸:比传统SOT-23封装小约60%,适合高密度PCB布局,例如无线耳机、智能手环等小型设备的内部空间;
  2. 引脚布局:10引脚设计,集成了CC1/CC2、Vconn、电源、接地及状态反馈等功能,无需额外引脚扩展;
  3. 散热性能:薄型封装(0.5mm)配合紧凑的引脚间距,散热效率满足低功耗应用需求,无需额外散热片。

封装的小型化直接推动了终端设备的轻薄化设计,符合当前消费电子“小型化、便携化”的趋势。

四、典型应用场景

FUSB301TMX的功能与参数特性,使其适配以下典型场景:

  1. 便携消费电子:智能手表、无线耳机、移动电源——低功耗延长续航,超小封装适配紧凑空间,DRP功能实现双向充电;
  2. 外设与配件:USB-C集线器、蓝牙键盘/鼠标——简化Type-C接口的基础控制,无需复杂PD协议,降低成本;
  3. 工业控制小模块:温度传感器、无线收发模块——宽温范围(-40~85℃)适应工业环境,低功耗适合电池供电的远程节点;
  4. 基础充电器:小型USB-C充电器(5V/2A)——实现Type-C接口的极性翻转与角色检测,替代传统Micro-USB接口,提升兼容性。

五、性能优势总结

FUSB301TMX的核心竞争优势可归纳为三点:

  1. 低功耗与宽电压兼容:静态电流7uA+2.8~5.5V电压范围,适配电池供电与多电源轨系统;
  2. 超小封装与高集成度:TMLP-10封装节省PCB空间,无需外部晶振,简化电路设计;
  3. Type-C基础功能完整:DRP、极性翻转、Vconn控制等必备功能齐全,满足大部分轻量级Type-C接口需求。

作为安森美成熟的Type-C控制产品线成员,FUSB301TMX具备稳定的量产可靠性,适合批量应用于中低端Type-C设备,平衡性能与成本。

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