Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON NSVBAS21HT1G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON NSVBAS21HT1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- NSVBAS21HT1G
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0094336261
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA@200V
- (Vf)
- 1.25V@200mA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 55℃~+150℃@(Tj)
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NSVBAS21HT1G 产品概述
产品简介
NSVBAS21HT1G 是由安森美（ON Semiconductor）生产的一款高性能标准开关二极管，具备出色的电气特性与可靠性，广泛应用于各种电子设备中的信号整流与开关电路。其设计主要满足小信号整流的需求，适合在严酷的环境条件下运行，具备良好的温度稳定性和反向特性。
主要参数
- 电压 - DC 反向 (Vr)：该二极管的最大直流反向电压为 250V，适合在高电压环境中使用，提供了良好的电气绝缘与安全保护。
- 电流 - 平均整流 (Io)：其平均整流电流为 200mA，能够满足大多数小型电流应用，确保在连续应用中表现稳定。
- 正向电压 (Vf)：在最大负载电流 200mA 下，Vf 为 1.25V，表明在传输信号时会有较低的电压损失，优化了电能效率。
- 速度：该器件适合小信号应用，具有任意速度特性，使其在开关频率较高的环境下仍然具有良好的响应速度。
- 反向恢复时间 (trr)：约 50ns 的反向恢复时间使其适合在快速开关应用中工作，能够满足高频操作需求。
- 反向泄漏电流：在各个反向电压状态下，反向泄漏电流低至 100nA @ 200V，标志着其在耐受高电压时依然能保持良好的性能，减少不必要的功耗。
- 工作温度范围：器件的工作结温范围为 -55°C 到 150°C，确保其在极端温度条件下依然能稳定工作，适合航空航天、汽车电子等应用场景。
封装与安装
NSVBAS21HT1G 使用 SOD-323 封装类型，具备表面贴装特点（SMT），使其在 PCB 板上的集成更加便捷，节省了空间同时也提高了组装效率。该封装适用于高密度电路设计，能有效支持现代电子产品对尺寸的严格要求。
应用领域
由于其卓越的电气特性，NSVBAS21HT1G 被广泛应用于以下领域：
- 通讯设备：用于整流和信号切换，确保信号传输的完整性与高效性。
- 消费电子产品：在低功耗和高效能整流电路中具有优越表现，广泛用于手机、平板电脑及其它便携式设备。
- 汽车电子：适用于汽车的电源管理系统，特别是需要耐温及耐压的应用。
- 工业设备：适合存在温度波动及电磁干扰的环境，确保系统稳定运行。
总结
NSVBAS21HT1G 是一款结合了高压、高频、小信号特性和广泛应用场景的标准开关二极管，依托于安森美在电子元器件领域的深厚技术背景，确保其产品在可靠性与性能上的领先地位。凭借卓越的热稳定性与反向特性，NSVBAS21HT1G 定会成为设计师在多种应用中的首选解决方案，为各种电子产品的功能与性能提升提供有力支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
