WMSIC Electronic Components

ON NTJD1155LT1G

ModelNTJD1155LT1G
PackageSC-88
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON NTJD1155LT1G
Type
ON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
NTJD1155LT1G
Electronic Component
1
Package
SC-88
Electronic Component
1 N +1 P
Type
N +P
Electronic Component
MOSFET
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0084417178
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
400mW
Gate Voltage(Vgs)
±8V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTJD1155LT1G 产品概述

一、产品简介

NTJD1155LT1G 是一款高性能的双极性场效应管(MOSFET),集成了一个 N 沟道和一个 P 沟道的场效应管,专为低电压应用而设计,封装为 SC-88,适合表面贴装(SMD)技术。这款 MOSFET 具有优异的电流承载能力和低导通电阻,非常适合在现代电子设备中使用,提供高效能且有效的电源管理解决方案。

二、主要参数

  • 安装类型: 表面贴装型(SMD)
  • 功率最大值: 400mW
  • 漏源电压(Vdss): 8V
  • 连续漏极电流(Id): 1.3A
  • 不同 Id、Vgs 时导通电阻(RDS(on)最大值): 175 毫欧(@ 1.2A,4.5V)
  • 不同 Id 时 Vgs(th)最大值: 1V(@ 250µA)
  • 工作温度范围: -55°C ~ 150°C
  • 封装/外壳类型: SC-88, SC70-6, SOT-363

三、电气特性

NTJD1155LT1G 的电气特性使其特别适合各种低压应用,如开关电源、小型电池供电设备和电机驱动电路。N 沟道和 P 沟道的组合设计使其可以在电路中实现多种开关控制功能,如信号切换和电压处理。其最大漏极电流为 1.3A,足够满足大部分低功耗电子设备的需求,同时其导通电阻仅为 175 毫欧,确保最低的功耗和发热。

四、工作环境

该 MOSFET 的工作温度范围为 -55°C 到 150°C,使其在极端环境下也能正常工作,特别适合汽车电子、工业控制和航空航天等对信号传输稳定性和可靠性有高要求的应用。

五、应用领域

NTJD1155LT1G 广泛应用于以下领域:

  1. 电源管理: 适用于电源开关、DC-DC 转换器等电源管理电路。
  2. 信号开关: 犹如音频或视频信号开关,控制信号的通断。
  3. 电机控制: 可用于驱动电机的控制电路中,提供高效的开关操作。
  4. 负载开关: 在各种低功耗负载应用中,作为负载开关使用。
  5. LED 驱动: 适合用作高效率的照明电路中的开关组件。

六、竞争优势

  • 低导通电阻: 175 毫欧的导通电阻使得该 MOSFET 在开启状态下的功耗最低,降低了能量损失,提高了效率。
  • 高工作温度范围: 适应严酷环境,确保产品在极端条件下仍能保持可靠性。
  • 紧凑封装: SC-88 封装体积小,适合各种空间受限的应用,便于批量生产。
  • 品牌信誉: 作为 ON(安森美) 的产品,其质量和性能得到了广泛的认可和信任。

七、总结

NTJD1155LT1G 是一款极具市场竞争力的 MOSFET,凭借其超低电阻、广泛的应用范围以及可靠的工作性能,为电子设备提供强有力的电源管理和信号控制解决方案。无论是在新的设计项目还是在产品的升级中,NTJD1155LT1G 都是值得考虑的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.