Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MC14011BDR2G 是由 ON Semiconductor(安森美半导体)制造的一款高性能四路与非门逻辑芯片,采用14-SOIC封装。这款芯片在广泛的电子应用中发挥着重要作用,尤其在需要逻辑电平转换和信号处理的领域,具备高精度、高可靠性的特性。它的工作电压范围为3V至18V,允许其在多种不同的电源配置下正常工作,适合应对多样化的设计需求。
逻辑类型:MC14011BDR2G 是一种与非门逻辑类型,允许其在逻辑电平转换和复杂逻辑处理应用中展现出良好的性能。
电路数和输入数:该芯片具备4个与非门电路,每个电路具有2个输入,能够满足多种逻辑运算需求,同时保持较小的封装尺寸。
电源和电流:
输出电流:
逻辑电平:
传播延迟:当以15V工作、负载电容为50pF时,最大传播延迟约为80ns,这对于高速逻辑电路设计来说是一个合理的表现。
工作温度:该元器件的工作温度范围从-55°C 至 125°C,适合极端环境下的应用,能够满足汽车、航空航天及高可靠性工业应用等领域的需求。
MC14011BDR2G采用14-SOIC封装,具有0.154″(3.90mm)宽,适合表面贴装(SMD)安装。SOIC封装的使用,使得该芯片在减少板级空间的同时,依旧能够维护良好的散热特性和稳定性。
MC14011BDR2G适合广泛的应用场景,包括:
数字逻辑电路:可用于实现复杂数字逻辑功能,适合各种数字电路设计。
信号处理:尤其适用于需要多路与非逻辑运算的信号处理应用。
嵌入式系统:常用于微处理器和微控制器外围的逻辑接口,提供灵活的信号处理能力。
汽车电子:能够在极端温度和电压条件下正常工作,非常适合汽车行业中的各种电子控制单元(ECU)。
工业自动化:可在恶劣的工业环境下,保证长期稳定的工作表现。
总体来看,MC14011BDR2G是一款功能强大且高效的与非门逻辑芯片,具备广泛的应用前景。其良好的电源适应性、低功耗、高输出能力及宽广的工作温度范围,使得它成为设计师在众多电子产品设计中的优选元件。无论是在复杂数字系统中,还是在简单的逻辑应用中,MC14011BDR2G均能提供优质的性能,助力开发出高效、可靠的电子设备。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products