WMSIC Electronic Components

ON MMBFJ309LT1G

ModelMMBFJ309LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBFJ309LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBFJ309LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET(JFET)
Electronic Component
0.03g
FETType
N
Electronic Component
1
Electronic Component
BM0058432219
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBFJ309LT1G 产品概述

概述与背景

MMBFJ309LT1G 是由安森美(ON Semiconductor)生产的一款 N 通道结型场效应管(JFET),它广泛应用于模拟信号处理、开关电路以及高频信号放大等领域。JFET 是一种电压控制型器件,由于其高输入阻抗和低噪声特性,成为了音频处理、电信和仪器设备中的重要元件。MMBFJ309LT1G 在电源管理、信号放大以及其他类似应用中表现出色。

电气规格

  1. 电压额定值:该器件的额定电压为25V,这使得其能够在多种电源条件下稳定工作。对于许多常见应用,如音频设备和低功耗数字电路,25V 的额定电压能够提供足够的裕度,保证了系统的稳定性和安全性。

  2. 额定电流:MMBFJ309LT1G 的额定电流为30mA,适合大部分中低功率应用。例如,在信号开关和放大电路中,该器件能够处理较为典型的信号电流,从而满足设计需求。

  3. 晶体管类型:它是一款 N 通道 JFET,N 通道结构具有较低的驱动电压和较高的电子迁移率,因而在开关速度和增益方面通常优于 P 通道器件。N 通道 JFET 在高频应用中的特性使其成为许多高性能电路的优选选择。

封装与应用

MMBFJ309LT1G 的封装形式为 SOT-23-3(TO-236),一种小型表面贴装封装,适合各种紧凑型电路设计。SOT-23 封装的特点是体积小、引脚布置合理,便于进行自动化贴装,同时能够有效节省PCB版面的空间,使得其在现代电子设备中得到广泛应用。

应用场景

  1. 模拟信号处理:由于其高输入阻抗和低输出噪声,MMBFJ309LT1G 非常适合于模拟信号放大器和信号调理电路。其特性使得其能够在非常微弱的信号条件下工作,确保信号的准确性和清晰度。

  2. 开关电路:在数字电路和开关电源中,JFET 的迅速开关能力使其成为优质的开关元件。可以在电源管理和控制电路中使用,以实现高效的功率切换,帮助降低功耗。

  3. RF 应用:MMBFJ309LT1G 在高频应用中表现优秀,适用于 RF 放大器和混频器等电路,有助于制作出高性能的接收和传输系统。

  4. 传感器接口:在需要将高阻抗传感器信号传递至后续信号处理电路的场景中,MMBFJ309LT1G 能够确保信号的完整性,避免信号衰减对系统性能的影响。

总结

总的来说,MMBFJ309LT1G 是一款功能丰富、性能卓越的 N 通道 JFET,具有很高的市场适应性。其电气性能、封装形式及应用范围使得该器件能够适应众多现代电子产品的需求,是设计师在选择电子元件时值得考虑的优秀选项。无论是在音频设备、网络通信、家用电器还是工业争夺应用中,MMBFJ309LT1G 皆能提供理想的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.