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ON MMSZ22T1G
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON MMSZ22T1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MMSZ22T1G
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.035g
- Electronic Component
- 1
- (Zzt)
- 55Ω
- Electronic Component
- BM0265082634
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 20.9V~23.1V
- Electronic Component
- 3000
- Electronic Component
- 22V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ22T1G 产品概述
一、产品简介
MMSZ22T1G 是 ON Semiconductor（安森美）推出的一款独立式小功率稳压二极管，标称稳压值 22V（5%），采用 SOD-123 贴片封装，2 引脚结构。器件体积小、引线短，适合高密度表面贴装电路，用作稳压、浪涌吸收及参考电压源等场合。
二、主要电气参数
- 标称稳压：22V（5%）；实际稳压范围：20.9V ~ 23.1V（典型制造公差）。
- 反向电流 Ir：50 nA @ 15.4V（极低漏电流，有利于高阻抗信号或待机电路）。
- 阻抗 Zzt：55 Ω（在规定测试电流下的动态阻抗，表示稳压特性优良）。
- 耗散功率 Pd：500 mW（器件最大耗散功率，需关注散热条件）。
- 封装：SOD-123，2 引脚，适合自动贴装生产。
三、热与功耗考量
按 Pd=0.5 W 与 Vz=22 V 简单计算，理论最大稳压电流约为 22.7 mA（I = Pd/V）。但该值是在良好散热及规定环境温度下的极限值。实际设计中建议降额使用：将工作电流控制在数毫安到十几毫安范围，并考虑环境温度与 PCB 散热能力。长时间靠近 Pd 上限会加速老化并影响稳压精度，必要时应在电路中加入串联限流电阻或选择更高功率等级的器件。
四、典型应用
- 22V 参考电压源与电压钳位（过压保护）。
- 电源排放/浪涌抑制器（与限流电路配合）。
- 工业与通信设备中的次级稳压和偏置电路。
- 低漏电需求的待机或监测电路。
五、PCB 布局与封装建议
SOD-123 封装小巧，焊盘设计应参考厂商推荐的 PCB 尺寸以保证良好热传导与焊接质量。靠近热源时需留意热耦合影响稳压点，必要时在器件下方或附近增加铜箔以改善散热。建议在可能的浪涌路径上增加适当串阻或限流元件以降低瞬态应力。
六、使用建议与可靠性
- 遵循制造商的回流焊工艺与温度曲线，避免过热导致封装损伤。
- 实施 ESD 防护：在制造和测试过程中保持静电安全。
- 长期可靠性上，尽量避免在额定 Pd 附近持续工作，并考虑环境温度对最大耗散的降额系数。
- 对于精密参考场合，应通过实验验证稳压在工作电流与温度范围内的偏差。
七、订购与替代
器件型号：MMSZ22T1G（ON Semiconductor），封装 SOD-123，适合自动化贴片生产。若需更大功率或更低阻抗的稳压性能，可考虑功率更高的 DO-214AA/SMB 或 SOD-123F 等不同封装与规格的 Zener 替代品。购买时请确认供应商型号、批次与规格书以匹配设计要求。
总结：MMSZ22T1G 以其 22V 稳压值、低漏电、紧凑 SOD-123 封装和 500 mW 的额定功耗，适用于中低功率的稳压与保护场景，但在实际应用中应注意功耗降额与 PCB 散热设计以保证长期稳定性。
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