Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON 1SMA5933BT3G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON 1SMA5933BT3G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- 1SMA5933BT3G
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Zener Diode
- Electronic Component
- 0.124g
- Electronic Component
- 1
- (Zzk)
- 650Ω
- (Zzt)
- 17.5Ω
- Electronic Component
- BM0000279128
- Diode
- 1
- Current(Ir)
- 500nA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 20.9V~23.1V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SMA5933BT3G 稳压二极管
引言
在现代电子设备中，稳压二极管因其出色的电压调节性能而被广泛应用于过压保护、信号调节和电源管理等领域。SMA5933BT3G是由安森美（ON Semiconductor）生产的一款高性能稳压二极管，其特性参数和性能使其适用于多种电子应用场景。
基本参数
SMA5933BT3G的标称齐纳电压（Vz）为22V，具有±5%的容差，能够为电路提供稳定的参考电压。该元件的最大功率为1.5W，适合中等功率的应用，非常适合在日常电子设备、工业设备及通信系统等多种场合使用。
此外，SMA5933BT3G的最大阻抗（Zzt）为17.5Ω，这一特性使其在电压波动较大的环境下也能保持较好的稳定性能。对于逆向电流的泄漏，SMA5933BT3G在16.7V时的反向泄漏电流为500nA，显示出其在电流控制方面的高效性和可靠性。
正向电压特性
在正向导电状态下，SMA5933BT3G的正向电压（Vf）为1.5V，在200mA的正向电流下，该特性表明其在输出电压调节和电源供给时具有低压降的优势，这有助于减少功耗和热量的产生，从而提高系统的整体效率。
工作环境
本稳压二极管的工作温度范围从-65°C到150°C，适应了极端环境下的电子应用。这一广泛的工作温度范围使得SMA5933BT3G能够在苛刻的工业、汽车及航空航天等领域中可靠工作。此外，SMA5933BT3G的封装类型为SMA（DO-214AC），这种表面贴装型设计便于在自动化生产线上进行高效组装。
应用领域
凭借其稳定的电压特性和相对低的漏电流，SMA5933BT3G非常适合以下应用：
- 电源保护：在电源电路中，SMA5933BT3G能够有效防止过压对敏感组件造成的损害。
- 信号调节：在各种信号调节电路中，提供稳定的电压参考，使信号处理更加准确。
- 工业控制系统：帮助保护工业设备在电涌和瞬态电压情况下的正常运行。
- 汽车电子：由于其宽工作温度范围，适合在车辆的电气系统中使用。
总结
SMA5933BT3G稳压二极管凭借其一系列优异的电气特性，提供了可靠的电压调节方案和强大的过压保护能力，是电子设计工程师在选择稳压元件时值得推荐的选择。它既适合一般消费者电子、工业设备，又能满足更为严苛的应用需求。选择SMA5933BT3G，您将获得高效、可靠和全面的稳压解决方案，为您的设计增添坚实的保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
