WMSIC Electronic Components

ON MC74HCT08ADR2G

ModelMC74HCT08ADR2G
Package14-SOIC
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MC74HCT08ADR2G
Type
ON
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MC74HCT08ADR2G
Electronic Component
1
Package
14-SOIC
Electronic Component
Logic Gate
Electronic Component
74HCT
Electronic Component
0.36g
Electronic Component
1
Channel Count
4
Electronic Component
BM0258839820
Operating Temperature
55℃~+125℃
Operating Voltage
2V~6V
Logic Type
and Gate
Current(IOH)
4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC74HCT08ADR2G 产品概述

一、概述

MC74HCT08ADR2G 是 ON Semiconductor(安森美)推出的四通道与门逻辑器件,属于 74HCT 系列高速 CMOS 逻辑家族。每通道提供一个两输入与门,适合在需与门逻辑、信号整形和门阵列等场合使用。器件在低静态功耗与 TTL 电平兼容性之间取得平衡,适配多种数字系统。

二、主要参数

  • 逻辑类型:与门(AND)
  • 通道数:4(四个独立两输入与门)
  • 工作电压:2 V ~ 6 V
  • 静态电流 (Iq):典型 1 μA(低功耗)
  • 输出驱动:IOL = 4 mA,IOH = 4 mA
  • 输入阈值:VIH = 2.0 V,VIL = 0.8 V(与 TTL 电平兼容)
  • 传播延迟:tpd = 17 ns (@ VCC = 5 V, CL = 50 pF)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 封装:14-SOIC(表面贴装)

三、功能特性

  • HCT 系列特点:采用高速 CMOS 结构,同时对 TTL 输入电平友好,便于与旧有 TTL 逻辑互联。
  • 低静态电流:待机功耗小,适用于对电源功耗敏感的设计。
  • 小封装、易焊接:14-SOIC 便于表面贴装生产与散热管理。
  • 可在较宽电源电压范围内工作,适配多种电源方案。

四、典型应用

  • 门控信号生成与逻辑合成(Glue Logic)
  • 数字控制与复位电路中的逻辑判断
  • 微控制器外围逻辑接口与片选逻辑
  • 低速数据路径的开关与使能控制

五、设计注意事项

  • 电源去耦:在 VCC 与 GND 之间放置 0.1 μF 陶瓷去耦电容,靠近芯片管脚以抑制瞬态噪声。
  • 输入不悬空:未使用的输入应接地或拉到确定电平,避免浮空引起功耗或不确定输出。
  • 输出驱动能力有限:单个输出推荐驱动不超过 4 mA,如需驱动较大负载请加缓冲器或驱动器。
  • 负载与延迟:传播延迟受负载电容影响,较大负载会增加 tpd,应在时序设计中考虑裕量。
  • 工作电压选择:尽管器件标称 2 V~6 V,可在目标系统电压下验证输入阈值与噪声裕度,保证可靠工作。

六、可靠性与采购提示

  • 器件适用温度范围宽,可满足工业级与部分高可靠性应用。
  • 选择带有环境与溯源认证的供应商渠道采购,确认包装与封装型号(14-SOIC)以匹配生产工艺。

该器件以其 TTL 电平兼容性、低静态功耗和紧凑封装,适合用于各类数字逻辑集中式或分布式设计中,作为可靠的与门逻辑单元。

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