WMSIC Electronic Components

ON NC7WZ04L6X

ModelNC7WZ04L6X
Package6-MicroPak
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON NC7WZ04L6X
Type
ON
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
NC7WZ04L6X
Electronic Component
1
Package
6-MicroPak
Electronic Component
Inverter
Electronic Component
7WZ
Electronic Component
0.011g
Electronic Component
1
Electronic Component
2
Channel Count
2
Features
Power Supply
Electronic Component
BM0264335793
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NC7WZ04L6X 产品概述

一、产品简介

NC7WZ04L6X 是 ON Semiconductor(安森美)7WZ 系列的双通道反相器(Inverter),采用紧凑的 6-MicroPak 封装。器件工作电压范围宽(1.65V ~ 5.5V),静态电流极低(Iq ≈ 1 μA),并具有电源关断保护(power-off protection),适合低功耗、空间受限及多电平系统的逻辑反相与缓冲场景。

二、主要电气性能

  • 工作电压(VCC):1.65 V 至 5.5 V,覆盖常见的 1.8V、2.5V、3.3V 和 5V 系统。
  • 静态电流(Iq):约 1 μA(典型值),适用于电池供电与低功耗设计。
  • 输出能力:IOH/ IOL 可达 ±32 mA,驱动能力较强,可直接驱动小型负载或 LED(在限流保护下)。
  • 传播延迟(tpd):3.6 ns(在 VCC=5V、CL=50 pF 条件下),响应速度适合中高速逻辑应用。
  • 通道/引脚:2 通道、2 个输入,双反相结构,封装为 6 引脚 MicroPak。
  • 工作温度范围:-40 ℃ ~ +85 ℃,满足工业级温度要求。

三、功能亮点

  • 低电压兼容:宽电压范围使其可在多种电源域间使用,便于多电压系统的逻辑设计。
  • 极低静态电流:在待机或断电情形下功耗极低,利于延长电池寿命。
  • 强输出驱动:32 mA 的拉/灌电流能力,能驱动较大的容性或阻性负载,减少外部缓冲器需求。
  • 电源关断保护:当 VCC 为 0V 或处于断电状态时,器件能防止对系统其他供电域的反向供电(back-drive),便于热插拔和多电源系统互连。

四、典型应用场景

  • 低功耗便携设备的逻辑反相与缓冲。
  • 多电压系统的信号接口与电平兼容处理(注意非专用电平移位器的局限)。
  • 时钟、脉冲或控制信号的反相与驱动。
  • 空间受限的消费电子、可穿戴设备与物联网节点(6-MicroPak 提供小封装优势)。
  • 需要电源断电保护的混合供电系统或模块化设计。

五、设计与布局建议

  • 去耦电容:在 VCC 引脚附近放置 0.1 μF 陶瓷去耦电容,尽量靠近引脚以抑制瞬态噪声。
  • 布线注意:输出驱动能力强,长线或大容性负载会增加驱动负担并可能影响上升/下降时间,推荐合理匹配阻抗或在输出端并联适当阻尼。
  • 热管理:32 mA 的输出能力在连续大电流条件下会产生热量,需评估 PCB 铜箔面积与环境散热,避免超出器件规格。
  • 电源顺序与上电:虽然器件有电源关断保护,但建议遵循良好电源上电顺序设计,避免长时间处于部分供电的边界状态。
  • 信号完整性:在高速切换或驱动大电容负载时,关注回流路径与接地完整性,减少地弹(ground bounce)。

六、总结

NC7WZ04L6X 以其宽电压范围、超低静态电流和较强的输出驱动能力,适用于需要低功耗、小封装和电源关断保护的通用逻辑反相与缓冲场景。设计中注意基本的去耦与热管理,可在便携设备、多电压接口以及空间受限的系统中发挥良好性能。若需更详细的电气参数(如输入阈值、功耗随电压/温度的变化曲线或管脚排列),建议参考 ON Semiconductor 的完整数据手册以进行最终设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.