WMSIC Electronic Components

ON MMBZ5257BLT1G

ModelMMBZ5257BLT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON MMBZ5257BLT1G
Type
ON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBZ5257BLT1G
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.03g
Electronic Component
1
(Zzk)
700Ω
(Zzt)
58Ω
Electronic Component
BM0227516230
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
225mW
Electronic Component
31.35V~34.65V
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBZ5257BLT1G稳压二极管产品概述

一、产品基本信息

MMBZ5257BLT1G是安森美(ON Semiconductor) 推出的一款独立式稳压二极管,采用SOT-23表面贴装封装,属于小型化稳压器件范畴。该型号针对低功耗、高密度电路设计优化,具备稳定的电压调节能力与宽环境适应性,是工业、消费电子及通信领域的常用稳压元件。

二、核心电气参数解析

该器件的关键电气性能参数明确且适配多场景需求,核心参数如下:

  1. 稳压特性:标称稳压值为33V,实际工作稳压范围覆盖31.35V~34.65V(包含±5%设计余量);测试电流下动态阻抗(Zzt)为58Ω,拐点电流下阻抗(Zzk)为700Ω,阻抗稳定可抑制负载波动对输出电压的影响。
  2. 反向漏电流:25℃环境下反向电流(Ir)仅100nA,低漏电流显著降低待机功耗,适合电池供电设备。
  3. 功耗与温度:最大耗散功率(Pd)为225mW,满足中小功率电路需求;工作结温范围覆盖**-65℃~+150℃**,适应极端高低温环境。

三、关键性能特点

基于参数优势,该器件具备以下核心亮点:

  1. 稳压精度与余量平衡:±5%稳压范围既保证精度,又预留设计裕量,兼容不同负载条件下的电压波动。
  2. 低功耗适配性:100nA反向漏电流远低于普通稳压管,减少待机损耗,延长电池续航。
  3. 宽温环境兼容性:-65℃至+150℃结温范围,可在严寒(户外基站)、高温(汽车电子)场景稳定工作。
  4. 小型化封装优势:SOT-23封装体积仅约2.9×1.6×1.1mm,占用PCB空间小,适配高密度集成设计。

四、典型应用场景

该器件的性能特点使其在多领域广泛应用:

  1. 便携式电子:智能手机、智能手表的电源管理电路,辅助稳压同时适配小体积需求。
  2. 工业控制:PLC、传感器节点的参考电压源,宽温特性适应工业现场高低温变化。
  3. 通信设备:基站、路由器的信号偏置电路,稳定33V电压为射频模块提供可靠偏置。
  4. 消费电子:电视、机顶盒的过压保护辅助电路,配合元件实现过压钳位,保护敏感器件。

五、封装与可靠性说明

SOT-23封装兼容自动化贴装生产线,提升生产效率;安森美对该型号进行严格可靠性测试(温度循环、湿度老化),符合工业级标准,长期工作稳定性可靠。

总结而言,MMBZ5257BLT1G凭借稳定稳压性能、低功耗、宽温适应性及小型化封装,成为多领域电路设计的可靠选择,尤其适合对体积、功耗及环境适应性有严格要求的场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.