WMSIC Electronic Components

ON BC857BTT1G

ModelBC857BTT1G
PackageSOT-416F
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON BC857BTT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
BC857BTT1G
Electronic Component
1
Package
SOT-416F
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0227074931
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC857BTT1G 产品概述

一、产品简介

BC857BTT1G是一款高性能的PNP型三极管,专为低功耗应用设计,适合电流控制和信号放大等多种应用。该器件由安森美(ON Semiconductor)制造,封装形式为SC-75 / SOT-416,具有优良的散热性和电气性能,使其在现代电子产品中广泛应用。

二、主要参数

  1. 晶体管类型:PNP

    • 作为PNP型晶体管,BC857BTT1G在负载连接到正电源时表现优越,适用于开关和放大电路。
  2. 集电极电流最大值(Ic):100mA

    • BC857BTT1G的集电极电流最大值为100mA,能够支持大部分需要较高输出电流的应用。
  3. 集射极最大击穿电压(Vceo):45V

    • 最大集射极击穿电压为45V,这使得该元器件在高电压应用中具有良好的安全性,适合于电源管理和信号处理。
  4. 饱和压降(Vce_sat):650mV at 5mA 和 100mA

    • 在较小的电流条件下(5mA和100mA),饱和压降为650mV,表明其在开关状态下的效率较高,能有效降低功耗。
  5. 集电极截止电流(ICBO):15nA

    • 极低的截止电流特性使得该晶体管在长时间待机时依然保持较小的泄漏电流。
  6. 直流电流增益(hFE):220 at 2mA,5V

    • 在较低的偏置电流下(2mA)能够提供高达220的电流增益,代表了良好的放大能力,特别适合于小信号放大器应用。
  7. 功率最大值:200mW

    • 最大功率为200mW,适配丰富的低功耗电路设计,确保其在低功耗和高效率条件下具有良好的工作表现。
  8. 频率跃迁:100MHz

    • 较高的频率特性使其适用于RF和高频信号处理,拓展了其应用范围。
  9. 工作温度范围:-55°C ~ 150°C

    • 宽广的工作温度范围,使得BC857BTT1G在极端环境下也能稳定工作,适用于汽车、航空和工业控制等场合。

三、封装和安装

BC857BTT1G采用SC-75 / SOT-416无铅表面贴装封装,具有较小的占板面积,使其能够在紧凑的电路板设计中得以有效利用。此外,该封装设计还提供了良好的热性能,有助于提高器件的工作稳定性。

四、应用场景

BC857BTT1G广泛应用于:

  • 低功耗放大器:如音频信号放大和传感器信号处理。
  • 开关电路:用于各类小功率开关控制电路。
  • 驱动电路:可驱动LED、继电器和小型电机等负载。
  • 信号处理:在各类电子设备中用于信号的放大及传输。
  • 汽车电子、消费电子和工业控制领域。

五、总结

BC857BTT1G以其卓越的性能参数和广泛的应用范围,成为现代电子设计中重要的基础元器件。凭借高增益、低功耗和高电压能力,适合各类小信号放大、开关控制和信号处理应用,能够为设计师提供极大的便利和灵活性,进而推动电子产品的发展与创新。无论是在需要高可靠性和长寿命的环境中,还是在日常消费电子产品,BC857BTT1G都能展现出其优异的性能,是构建稳固电路的理想选择。

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