Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MC74VHC1G08MU2TCG 是安森美(ON Semiconductor)出品的单路与门逻辑器件,属于 74VHC 高速 CMOS 系列。器件集成一个两输入与门,适用于 2.0V 至 5.5V 宽电源电压范围的系统,针对对空间、功耗和速度有综合要求的现代电子产品设计。
该器件以 VHC 系列 CMOS 工艺实现,具备高速与低功耗的平衡。输入输出电平随电源电压变化,设计时应参考器件电平阈值与上升/下降时间。请在实际电路中注意 IO 限流与负载容量,以避免超出 8 mA 的输出能力。
采用 6 引脚 UDFN(1.2 mm × 1.0 mm)超小型封装,适合空间受限的移动设备和高密度模块。小尺寸封装对焊接工艺和热散能力有更高要求,建议遵循厂家回流曲线并确保良好 PCB 散热与焊盘设计。
适用于电平逻辑合成、控制信号门控、使能逻辑、时钟/复位组合逻辑、接口桥接等。设计时建议:
MC74VHC1G08MU2TCG 以其宽工作电压、低静态电流、适中输出驱动和小尺寸封装,为空间受限且对功耗、速度有要求的数字电路提供高效的单路与门解决方案。选型与布局时遵循上述设计建议,可在可靠性与性能间获得良好平衡。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products