WMSIC Electronic Components

ON MC74VHC1G08MU2TCG

ModelMC74VHC1G08MU2TCG
Package6-UDFN(1.2x1)
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON MC74VHC1G08MU2TCG
Type
ON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MC74VHC1G08MU2TCG
Electronic Component
1
Package
6-UDFN(1.2x1)
Electronic Component
Logic Gate
Electronic Component
74VHC
Electronic Component
0.494g
Electronic Component
1
Channel Count
1
Features
Driver
Electronic Component
BM0258836236
Operating Temperature
55℃~+125℃
Operating Voltage
2V~5.5V
Logic Type
and Gate
Current(IOH)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC74VHC1G08MU2TCG 产品概述

一、产品简介

MC74VHC1G08MU2TCG 是安森美(ON Semiconductor)出品的单路与门逻辑器件,属于 74VHC 高速 CMOS 系列。器件集成一个两输入与门,适用于 2.0V 至 5.5V 宽电源电压范围的系统,针对对空间、功耗和速度有综合要求的现代电子产品设计。

二、主要特性

  • 逻辑类型:与门(AND),单通道设计,便于局部逻辑扩展。
  • 工作电压:2.0 V ~ 5.5 V,兼容 2.0V/2.5V/3.3V/5V 等常见电源域。
  • 静态电流(Iq):典型 1 μA,低静态耗电,适合电池供电或待机场景。
  • 驱动能力:灌电流 IOL = 8 mA,拉电流 IOH = 8 mA,支持中等负载驱动能力。
  • 速度指标:传播延迟 tpd = 7.9 ns(VCC = 5V,CL = 50 pF),满足多数控制与数据路径时序要求。
  • 工作温度范围:-55 ℃ ~ +125 ℃,工业级可靠性。

三、电气参数概览

该器件以 VHC 系列 CMOS 工艺实现,具备高速与低功耗的平衡。输入输出电平随电源电压变化,设计时应参考器件电平阈值与上升/下降时间。请在实际电路中注意 IO 限流与负载容量,以避免超出 8 mA 的输出能力。

四、封装与热环境

采用 6 引脚 UDFN(1.2 mm × 1.0 mm)超小型封装,适合空间受限的移动设备和高密度模块。小尺寸封装对焊接工艺和热散能力有更高要求,建议遵循厂家回流曲线并确保良好 PCB 散热与焊盘设计。

五、应用场景与设计注意事项

适用于电平逻辑合成、控制信号门控、使能逻辑、时钟/复位组合逻辑、接口桥接等。设计时建议:

  • 对未使用输入引脚做明确上拉或下拉,避免漂浮。
  • DC 电源侧加 0.1 μF 陶瓷旁路电容,靠近器件 VCC 与 GND 引脚放置。
  • 确保负载电流不超过 IOH/IOL 规格,如需更高驱动能力应加缓冲驱动器。
  • 在高速边沿或长线驱动时关注信号完整性与负载电容 CL。

六、小结

MC74VHC1G08MU2TCG 以其宽工作电压、低静态电流、适中输出驱动和小尺寸封装,为空间受限且对功耗、速度有要求的数字电路提供高效的单路与门解决方案。选型与布局时遵循上述设计建议,可在可靠性与性能间获得良好平衡。

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