Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ2RKF3743X是松下电子推出的一款0402封装厚膜贴片电阻,专为高密度、高可靠性电子设计打造,具备精准阻值控制、宽温区稳定工作等核心特性,广泛适配消费电子、工业控制、通信设备等多领域应用场景。
阻值精度:±1%
满足工业级及消费电子对信号精准度的需求,可有效避免电路中因阻值偏差导致的信号偏移、增益异常等问题。
温度系数(TCR):±100ppm/℃
温度每变化1℃,阻值变化量约为37.4Ω(374kΩ×100ppm),在宽温区下保持阻值稳定性,适配高低温交替的工作环境。
功率与电压特性:
0402封装尺寸紧凑,公制规格为1.0mm(长)×0.5mm(宽)×0.35mm(厚),重量仅约0.01g,支持PCB高密度集成,尤其适用于小型化电子设备(如智能手机、可穿戴设备、小型工业传感器)。
封装采用陶瓷基片+厚膜电阻层结构,表面平整,兼容自动贴装(SMT)工艺,贴装效率高,焊点可靠性强,可降低量产中的焊接不良率。
环境耐受能力:
长期可靠性验证:
松下作为全球电子元器件龙头,ERJ2RKF3743X遵循严格的质量管控体系,符合RoHS、REACH等环保标准,采用无铅封装(符合IEC 61249-2-21)。产品出厂前经全参数测试,确保性能一致性,广泛应用于全球知名企业的量产项目,获得行业高度认可。
ERJ2RKF3743X凭借紧凑封装、精准阻值、宽温稳定及高可靠性,成为小型化电子设计中厚膜贴片电阻的优选方案,适配多领域电子设备的性能需求,兼顾量产效率与成本控制。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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