WMSIC Electronic Components

ERJ2RKF4703X

ModelERJ2RKF4703X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ2RKF4703X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ2RKF4703X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
470kΩ
Electronic Component
1
Electronic Component
BM0257349555
Operating Temperature
55℃~+155℃
Operating Voltage
100V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2RKF4703X 贴片厚膜电阻产品概述

一、产品基本识别

ERJ2RKF4703X是松下(PANASONIC)推出的一款0402封装贴片厚膜电阻,属于常规精度、小功率电阻范畴。型号编码清晰对应核心参数:“4703”表示阻值470kΩ(470×10³),“KF”代表精度±1%、温度系数±100ppm/℃,“R”对应额定功率100mW,“X”为封装及包装标识。该产品采用丝网印刷厚膜浆料于陶瓷基片的制造工艺,兼具成本优势与性能稳定性,是小型电子设备中常用的基础元件。

二、核心性能参数

  1. 阻值与精度:标准阻值470kΩ,精度±1%,满足大多数电子电路对阻值偏差的要求(无需高精度等级即可覆盖一般信号处理、分压限流场景);
  2. 功率与电压:额定功率100mW,最大工作电压100V,适用于小信号电路(如音频、传感器信号调理),避免功率过载风险;
  3. 温度特性:温度系数±100ppm/℃,即温度每变化1℃,阻值变化±47Ω(470kΩ×100ppm),在宽温范围内漂移可控;
  4. 工作温度范围:-55℃至+155℃,覆盖工业级、汽车级部分应用场景的温度需求,无需额外降额使用。

三、技术特性与可靠性

  1. 厚膜工艺优势:采用高稳定性厚膜浆料,陶瓷基片散热性好,长期使用后阻值漂移小,符合IEC、JIS等标准的可靠性要求;
  2. 抗环境干扰:厚膜电阻的膜层结构抗电磁干扰能力优于薄膜电阻,适合存在轻微电磁环境的电路;
  3. 封装可靠性:0402封装采用陶瓷/树脂复合结构,机械强度满足振动(如汽车行驶振动)、冲击测试要求,贴装后焊点可靠性高。

四、典型应用场景

  1. 消费电子:手机、平板、智能穿戴设备的音频电路偏置电阻、信号分压电阻,以及电源管理模块的小功率限流电阻;
  2. 工业控制:小型传感器(温度、压力传感器)的信号调理电路(分压、滤波),PLC输入输出模块的辅助电阻;
  3. 汽车电子:仪表盘背光电路、车身控制模块(BCM)的辅助信号电阻,宽温范围适配车载环境(-40℃~+85℃);
  4. 通信设备:无线路由器、基站射频前端的小信号匹配电阻,0402封装适配高密度PCB设计需求。

五、品牌与封装价值

  1. 松下品牌保障:作为全球知名厂商,松下在电阻制造领域拥有数十年经验,产品一致性好、品控严格,批次间参数偏差极小;
  2. 0402封装优势:体积仅1.0mm×0.5mm,大幅节省PCB空间,适合小型化、高密度设计(如可穿戴设备、微型医疗设备);同时支持高速SMT贴装,提升生产效率,降低制造成本。

该产品凭借稳定的性能、紧凑的封装及可靠的品牌背书,成为电子设备小型化设计中的高性价比选择。

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