WMSIC Electronic Components

EXCX4CE900U

ModelEXCX4CE900U
PackageSMD-4P,0.7x0.5mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC EXCX4CE900U
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
EXCX4CE900U
Electronic Component
1
Package
SMD-4P,0.7x0.5mm
Electronic Component
Common Mode Filter
Electronic Component
0.01g
Electronic Component
1
Channel Count
2
Electronic Component
BM0264574018
Operating Temperature
40℃~+85℃
Voltage
5V
Current
100mA
@Frequency
90Ω@100MHz
Resistor(DCR)
3Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EXCX4CE900U 产品概述

一、产品简介

EXCX4CE900U 是松下(PANASONIC)推出的一款高性 能共模滤波器(CMF),为双通道设计,针对高速差分信号线的共模噪声抑制进行优化。器件尺寸极小(0.65 × 0.5 × 0.3 mm),适合空间受限的移动设备及便携式电子产品。典型电气参数包括:阻抗 90 Ω @ 100 MHz、额定电压 5 V、额定电流 100 mA,直流电阻(DCR)约 3 Ω,工作温度范围 -40 ℃ ~ +85 ℃。

二、主要特性

  • 双通道结构,节省 PCB 占板面积并便于差分对布线。
  • 在 100 MHz 附近提供约 90 Ω 的共模阻抗,有效抑制该频段的共模干扰。
  • 额定电流 100 mA,适用于弱电信号及低功耗差分接口。
  • 超小 SMD 封装(0.65 × 0.5 × 0.3 mm),满足微型化设计需求。
  • 宽温工作范围,适应工业级及消费电子常见环境。

三、电气与环境规格

  • 通道数:2
  • 额定电流:100 mA(直流)
  • 阻抗:90 Ω @ 100 MHz(共模)
  • 额定电压:5 V
  • 直流电阻(DCR):约 3 Ω
  • 工作温度:-40 ℃ ~ +85 ℃
    这些参数决定了器件在高速差分线(尤其接近 100 MHz 的带宽)上对共模噪声的抑制能力及对直流偏置的承载能力。

四、典型应用

  • 移动终端与可穿戴设备的差分信号线去噪(如短距高速接口)
  • 无线模块与射频前端邻近电路的共模干扰控制
  • 传感器数据线、低功耗蓝牙、音频/视频微型接口等对空间和封装有严格限制的应用场景
    建议在选型时综合考虑信号带宽、差分阻抗匹配及允许的插入损耗。

五、封装与布局建议

  • 器件为 SMD 超小封装(0.65 × 0.5 × 0.3 mm),焊盘设计应参考厂方推荐的焊盘尺寸与间距以保证焊接可靠性。
  • 推荐将共模滤波器靠近信号源或连接器放置,以最小化未滤波段的线长,提升滤波效果。
  • 对于高速差分线,注意维持差分对的线宽和间距,避免在器件附近产生不必要的阻抗跳变。
  • 返修与回流焊请遵循 JEDEC/IPC 的通用回流曲线与制造商的湿敏等级(如器件为湿敏,需要做干燥处理)。

六、存储与使用注意事项

  • 运输与存储建议采用防潮包装,避免长期潮湿环境导致焊接缺陷。
  • 装配与测试过程中注意静电防护(ESD),以防损伤微小结构。
  • 在高频应用中,实际滤波效果会受 PCB 布局、接地平面与邻近元件影响,设计时建议做仿真与实验验证。

若需器件的详细封装图、焊盘建议或样品与大货采购信息,请联系松下官方或授权分销商获取原厂资料与支持。

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