WMSIC Electronic Components

ERJ3EKF63R4V

ModelERJ3EKF63R4V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF63R4V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF63R4V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
63.4Ω
Electronic Component
1
Electronic Component
BM0257349726
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ3EKF63R4V 厚膜贴片电阻产品概述

ERJ3EKF63R4V是松下推出的0603封装厚膜贴片电阻,针对低功耗、小信号电路的稳定阻值控制需求设计,兼具精度可靠性与环境适应性,广泛适配消费电子、工业控制等多领域应用。

一、核心参数精准定义

该电阻的关键性能参数明确,可直接匹配电路设计需求:

  • 阻值与精度:标称阻值63.4Ω,精度±1%,满足大部分常规电路对阻值误差的控制要求(无需高精度电阻的额外成本);
  • 功率与电压:额定功率100mW,最大工作电压75V,适配低功耗信号调理、小型驱动辅助电路;
  • 温度特性:温度系数±100ppm/℃,工作温度范围-55℃~+155℃,覆盖工业、汽车级环境的温度波动;
  • 封装规格:0603封装(尺寸1.6mm×0.8mm),符合贴片元件的高密度组装需求。

二、工艺设计保障性能稳定

作为厚膜电阻,ERJ3EKF63R4V采用松下成熟的厚膜印刷+激光微调工艺:

  1. 厚膜层结构:通过多层陶瓷基底印刷电阻浆料,形成稳定的电阻膜层,避免薄膜电阻易受机械应力影响的缺陷;
  2. 激光微调阻值:生产中采用激光精确修正电阻膜层,确保±1%精度的一致性,批量产品阻值偏差极小;
  3. 封装材料适配:采用耐高温环氧树脂封装,既保护内部电阻膜层,又提升抗潮湿、抗机械损伤能力,延长使用寿命。

三、多场景适配性分析

基于参数特性,该电阻可覆盖以下典型应用:

  1. 消费电子:手机、平板等便携设备的音频信号调理电路(100mW功率适配小信号输出,0603封装缩小整机体积);
  2. 工业控制:传感器信号放大电路(±1%精度保证信号采集准确性,-55℃~+155℃满足工业现场温变);
  3. 汽车电子:车载小功率辅助电路(如仪表盘指示灯驱动、传感器接口电路,符合汽车级温度要求);
  4. 通信设备:路由器、基站的小型滤波/分压电路(高密度0603封装适配PCB高密度布线)。

四、环境适应性与可靠性

ERJ3EKF63R4V的可靠性体现在以下两点:

  • 温度稳定性:温度系数±100ppm/℃,在工作温度范围内,阻值最大变化量不超过±0.634Ω(63.4Ω×100ppm/℃×100℃),仍在±1%精度范围内,无需额外温度补偿;
  • 宽温域可靠性:-55℃低温下无阻值漂移,+155℃高温下封装材料无变形,通过松下严格的环境可靠性测试(如温度循环、湿热老化),满足工业级5年以上使用寿命要求。

五、品牌与封装优势

松下作为电子元器件领域的龙头品牌,ERJ3EKF63R4V具备:

  • 品质一致性:批量生产中阻值偏差控制在±1%内,避免不同批次间性能差异;
  • 供应链稳定:持续供货能力强,适配企业长期生产需求;
  • 环保合规:符合RoHS、REACH等国际环保标准,无铅封装适配无铅回流焊工艺。

综上,ERJ3EKF63R4V是一款性能均衡、适配性广的厚膜贴片电阻,可满足多数常规电路对阻值精度、功率、温度适应性的需求,是消费电子、工业控制等领域的高性价比选择。

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