WMSIC Electronic Components

ERA3ARB103V

ModelERA3ARB103V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA3ARB103V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA3ARB103V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.03g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0257349575
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±10ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERA3ARB103V 产品概述

一、产品简介

ERA3ARB103V 为 PANASONIC(松下)系列高可靠性薄膜贴片电阻器,封装规格为 0603(约 1.6 mm × 0.8 mm),阻值 10 kΩ,精度 ±0.1%。该器件采用薄膜工艺制程,具有极低的温漂和出色的长期稳定性,适合要求高精度与高可靠性的消费电子、工业及通信类电路中做精密分压、参考、反馈和低噪声阻抗匹配等用途。

二、核心参数

  • 阻值:10 kΩ
  • 精度:±0.1%
  • 功率额定:100 mW(0.1 W)
  • 最大工作电压:75 V
  • 温度系数(TCR):±10 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0603(薄膜贴片)
  • 品牌:PANASONIC(松下)

三、主要性能与可靠性

ERA3ARB103V 以薄膜沉积与激光精密修整技术实现高精度阻值和极低的温度系数,工作温度范围宽、长期漂移小,适合高可靠性设计。典型特性包括:

  • 极低温漂(±10 ppm/℃),在温度变化时阻值稳定,适合温度敏感电路;
  • 高精度 ±0.1%,减少配件匹配或校准工作;
  • 宽温度范围与良好长期稳定性,满足工业级与汽车电子对寿命与可靠性的要求;
  • 小封装低寄生,便于高密度贴片与高速或高频电路布线。

四、典型应用场景

  • 精密电压分压与参考电路;
  • 仪器仪表与数据采集前端;
  • 高频/低噪声放大器的偏置网络;
  • 通信设备与消费电子中的阻值匹配与滤波网络;
  • 要求长期稳定性和温度稳定性的工业控制应用。

五、封装与装配建议

  • 封装:采用 0603 卷带(Tape & Reel)形式,适配自动贴片生产线;
  • 回流焊:建议按 PCB 与元件厂商推荐的回流曲线执行(最高回流峰值温度一般不超过 260 ℃,并按焊膏与PCB工艺规范控制);
  • 功率降额:器件额定功率通常在环境温度 70 ℃ 时给出,超过此温度时应按线性降额规则进行热管理,避免靠近发热元件;
  • 处理与储存:避免机械冲击、强酸碱环境及潮气,贴片前按常规防潮要求处理。

六、选型与注意事项

  • 若电路中出现较高脉冲电压或长期高压,应考虑电压系数与击穿裕量,75 V 为典型最大工作电压限制;
  • 在高精度测量场合,注意焊盘设计与热传导对阻值的影响,避免过度热应力导致阻值漂移;
  • 若需要更高功率或更宽温度裕量,可考虑大封装或专用塑封/金属化电阻元件;
  • 采购时确认包装批次、环境试验记录与松下提供的规格书以确保一致性。

总结:ERA3ARB103V 结合薄膜工艺的低TCR 与高精度特性,在尺寸微小的 0603 封装下为高可靠性、温度稳定性要求高的应用提供可靠的精密阻值解决方案。

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