WMSIC Electronic Components

ERJ2RKF4302X

ModelERJ2RKF4302X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ2RKF4302X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ2RKF4302X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
43kΩ
Electronic Component
1
Electronic Component
BM0257349700
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2RKF4302X 厚膜贴片电阻产品概述

ERJ2RKF4302X是松下(PANASONIC)针对低功耗、高密度电路设计推出的0402封装厚膜贴片电阻,核心参数匹配工业级与消费电子的常规需求,以下从多维度展开详细概述。

一、产品核心身份与基础参数

ERJ2RKF4302X属于松下ERJ系列厚膜贴片电阻,型号编码明确对应产品特性:

  • ERJ:松下厚膜贴片电阻系列代号;
  • 2RKF:小功率高精度子系列标识;
  • 4302:阻值代码(43×10²Ω=43kΩ);
  • X:封装与包装后缀(0402封装)。

核心参数清晰可查:

参数项 规格值 电阻类型 厚膜电阻 额定阻值 43kΩ 精度等级 ±1% 额定功率(25℃) 100mW 温度系数(TCR) ±100ppm/℃ 工作温度范围 -55℃~+155℃ 封装尺寸 0402(英制:1.0mm×0.5mm)

二、厚膜电阻技术的实用优势

厚膜电阻采用丝网印刷+高温烧结工艺制造,相比薄膜电阻(如镍铬合金薄膜)具有成本与性能的平衡优势:

  1. 阻值覆盖广:可实现1Ω~10MΩ的宽阻值范围,适配从限流到分压的多场景需求;
  2. 抗浪涌能力强:厚膜层厚度大于薄膜,对瞬间过流的耐受度更高,减少电路损坏风险;
  3. 批量一致性好:印刷工艺重复性高,批量产品阻值偏差极小,适合大规模自动化生产。

ERJ2RKF4302X针对小功率场景优化了电阻膜层厚度,既保证100mW功率承载,又控制了封装尺寸。

三、0402封装的高密度适配性

0402封装(公制1005)是当前贴片电阻的主流小封装之一,尺寸仅为1.0mm(长)×0.5mm(宽)×0.3mm(厚),核心优势:

  1. PCB空间利用率高:可在相同面积PCB上布置更多元件,适配智能手机、智能穿戴等小型化设备;
  2. 功率适配性:100mW额定功率(25℃环境)满足大多数低功耗电路(如传感器信号调理、MCU外围)需求;
  3. 贴装兼容性:与主流SMT贴片机兼容,贴装效率高,废品率低于行业平均水平。

注:高温环境需按松下降额曲线使用,155℃时额定功率降至约25mW,需根据实际温度核算功率余量。

四、精度与温度稳定性的实际表现

ERJ2RKF4302X的**±1%精度**属于工业级常用精度,可满足:

  • 信号分压电路的准确比例(如ADC输入分压);
  • 限流电路的电流控制(如LED驱动限流); 无需额外校准即可实现稳定电路性能。

±100ppm/℃的温度系数,意味着温度每变化1℃,阻值变化≤0.01%。典型场景验证:

  • 环境从25℃升至155℃(变化130℃),阻值变化±1.3%;
  • 结合初始±1%精度,总阻值变化范围±2.3%,覆盖工业设备宽温需求。

五、宽温范围的环境适应性

工作温度**-55℃~+155℃**覆盖多类场景:

  1. 工业控制:户外PLC、电机控制单元的高低温循环;
  2. 车载电子:部分车载信息娱乐系统的温度范围(需确认AEC-Q200认证,宽温特性适配);
  3. 高可靠性需求:极端温度下阻值稳定,减少长期使用漂移或失效。

松下厚膜工艺优化了电阻膜层与陶瓷基底的结合,耐受温度循环与湿度变化,降低故障率。

六、典型应用场景梳理

ERJ2RKF4302X的参数特性适配以下场景:

  1. 消费电子:智能手机电源管理、智能手表传感器接口;
  2. 工业控制:PLC I/O模块、温度传感器信号调理;
  3. 通信设备:路由器信号滤波、交换机限流保护;
  4. 小型医疗仪器:血糖仪、血氧仪低功耗电路(医疗认证场景除外);
  5. 物联网设备:低功耗传感器节点的分压与限流。

七、松下品牌的品质支撑

松下作为头部元器件厂商,产品符合严格标准:

  1. 可靠性验证:通过高温存储(155℃×1000h)、温度循环(-55℃~155℃×500次)等测试;
  2. 环保合规:符合RoHS 2.0、REACH标准,无铅无镉;
  3. 供货稳定:大规模量产能力,满足批量订单需求,降低供应链风险。

综上,ERJ2RKF4302X是一款性价比高、适配性强的厚膜贴片电阻,适合对尺寸、精度、宽温有要求的低功耗电路设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.