Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERA6AEB101V为松下(PANASONIC)品牌的贴片薄膜电阻,核心参数如下:
高精度与低温漂
±0.1%的阻值精度远高于普通厚膜电阻(通常±1%~±5%),配合±25ppm/℃的温度系数,可在宽温度范围内保持阻值稳定——例如在125℃环境下,阻值漂移量仅为100Ω×25ppm/℃×180℃=0.045Ω,满足精密电路对信号一致性的要求。
紧凑封装与高可靠性
0805封装体积小(2.0mm×1.2mm),适配高密度PCB设计(如智能手机、可穿戴设备的主板);薄膜电阻采用真空溅射工艺,膜层均匀性优于厚膜印刷,长期使用阻值老化率低,通过松下严苛的可靠性测试(如1000小时高温存储、500次温度循环测试)。
宽温与耐压适配
-55℃+155℃的工作温区覆盖工业级(-40℃+85℃)与部分汽车级(-55℃~+125℃)应用需求;100V额定电压可应对中等电压场景(如电源反馈分压、信号调理高压端)。
精密模拟信号处理
适用于仪表放大器、12~16位ADC数据采集模块的参考分压电路,其高精度与低温漂特性可降低信号失真,保证采样误差控制在0.1%以内。
电源反馈与控制电路
用于开关电源的电压反馈网络(如Buck/Boost电路输出分压),100Ω阻值配合125mW功率,可稳定实现电压采样与调节,避免反馈误差导致的输出波动(如±0.5%以内)。
工业控制与汽车辅助电路
宽温特性适配工业现场(如电机驱动信号检测)与汽车电子辅助模块(如座椅传感器、温度监测电路),应对极端温度变化(如户外设备的低温启动、高温暴晒)。
消费电子信号调理
0805封装适合智能手机、平板的传感器接口(如加速度计、陀螺仪信号滤波),满足小体积、高集成度设计需求,同时避免信号干扰。
功率与电压双限制
实际使用需同时满足两个约束:
精度匹配需求
若电路需要更高精度(如±0.05%),需选择同系列更高精度型号;若仅需±1%精度,可考虑成本更低的厚膜电阻,无需选用该款薄膜产品。
焊接兼容性
薄膜电阻焊接温度需控制在回流焊峰值≤260℃(持续时间≤10秒),避免高温损坏膜层结构;波峰焊需采用惰性气体保护,防止氧化导致阻值漂移。
松下ERA系列薄膜电阻符合IEC 61000-4-2(ESD防护)、JIS C 5201(电子元件通用标准)等行业规范,批量产品一致性好(阻值偏差控制在±0.08%以内),适合大规模量产应用。
该产品凭借高精度、低温漂、宽温适配等特性,成为精密电子电路的主流选择,尤其适合对信号稳定性要求较高的工业、消费电子领域。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products