WMSIC Electronic Components

ECHU1C222GX5

ModelECHU1C222GX5
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ECHU1C222GX5
Type
PANASONIC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ECHU1C222GX5
Electronic Component
1
Electronic Component
2.2nF
Package
0603
Electronic Component
Capacitor
Electronic Component
±2%
Electronic Component
0.03g
Electronic Component
1
Electronic Component
(PPS)
Electronic Component
BM0257240717
Operating Temperature
55℃~+125℃
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ECHU1C222GX5 产品概述

一、产品概述

ECHU1C222GX5 是松下(PANASONIC)出品的一款高稳定性薄膜/聚合物介质贴片电容,标称容值为 2.2nF,容差 ±2%,额定电压 16V,封装为 0603(SMD)。采用聚苯硫醚(PPS, polyphenylene sulfide)作为介电材料,工作温度范围广(-55℃ 至 +125℃),适合对容值精度、温度特性和长期可靠性有较高要求的消费电子与工业类电路。

二、主要规格参数

  • 容值:2.2 nF
  • 精度:±2%(高精度)
  • 额定电压:16 V
  • 介电材料:聚苯硫醚(PPS)
  • 封装:0603(级别 SMD)
  • 工作温度:-55℃ ~ +125℃
  • 封装形式:贴片,适配自动化贴装与回流焊工艺

三、材料与温度特性

PPS(聚苯硫醚)介质具有良好的介电稳定性和较低的介电损耗,能在较宽温度范围内保持容值稳定性和低漏电特性。该材料对温度、湿度与频率的影响较小,适用于需要长期稳定性能的滤波、耦合与定时电路。

四、性能特点

  • 高精度:±2% 容差适合精密滤波和谐振电路应用。
  • 温度稳定:-55℃ 至 +125℃ 适应工业级温度环境。
  • 低损耗与低介电吸收:有利于高频信号处理和采样电路。
  • 小尺寸与高可靠性:0603 封装节省 PCB 面积,适合空间受限的设计。
  • 良好的重复回流焊兼容性:适用于常规 SMT 生产流程(请按厂家推荐焊接工艺操作)。

五、典型应用场景

  • 高频滤波与去耦(射频前端、模拟电路)
  • 时钟、振荡与谐振电路(对容差和温漂要求高的场合)
  • 信号耦合与旁路(运放前级、ADC/DAC 采样通道)
  • 消费电子、通讯设备、工业控制等对稳定性与可靠性有要求的产品

六、封装与贴装建议

由于为 0603 小封装,建议在 PCB 布局时考虑:

  • 将电容尽量靠近被去耦/耦合的器件引脚或电源引脚放置,走线短且宽,以降低寄生电感和阻抗。
  • 使用与焊盘匹配的回流焊工艺,遵循厂家关于回流温度曲线与峰值温度的推荐,避免过高热应力导致性能退化。
  • 在元件周围留出足够的焊盘与阻焊间距,便于贴装和检修。

七、可靠性与选型注意

  • ±2% 精度在批次间需关注容值和温漂规范,设计时可预留容差裕度以保证电路性能。
  • 在高湿、高腐蚀环境下使用时,需配合合适防护工艺或封装方案。
  • 如需更高耐压或更大容值,请参考松下同系列或其他封装尺寸的产品。选型时建议参考厂家完整数据手册以获取电气特性曲线、老化规范及详细回流焊工艺。

如需该型号的详细电气参数曲线(温度系数、频率响应、绝缘电阻、寿命测试数据)或替代型号建议,我可以帮您检索并整理厂家数据手册与对比方案。

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