WMSIC Electronic Components

AXK6A2337YG

ModelAXK6A2337YG
PackageSMD,P=0.5mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
PANASONIC AXK6A2337YG
Type
PANASONIC
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
AXK6A2337YG
Electronic Component
1
Package
SMD,P=0.5mm
Electronic Component
2
Electronic Component
and Connector
Electronic Component
0.54g
Electronic Component
0.5mm
PIN
120P
Electronic Component
1
Electronic Component
BM0264224036
Electronic Component
Electronic Component
Operating Temperature
55℃~+85℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AXK6A2337YG 板对板连接器产品概述

AXK6A2337YG是松下(PANASONIC)AXK系列中一款高PIN数、小间距的表面贴装(SMD)立贴型板对板连接器,专为高密度电子设备的可靠信号与电力传输设计,广泛应用于消费电子、工业控制及通信领域。

一、品牌与系列背景

松下作为全球电子连接领域的核心供应商,其AXK系列连接器以高可靠性、小间距高密度为核心特点,覆盖0.3mm~0.8mm多种间距规格,满足不同场景的连接需求。AXK6A2337YG属于该系列的立贴槽式对接产品,继承了AXK系列的成熟设计与稳定性能,是中高端电子设备的常用连接方案。

二、核心参数与物理特性

参数项 具体规格 连接类型 板对板(Board-to-Board) 安装方式 SMD立贴(表面贴装) 间距(Pitch) 0.5mm PIN总数 233PIN(2排布局) 对接方式 槽型凸-凹匹配 触头镀层 镀金(金层厚度≥0.2μm) 工作温度范围 -40℃ ~ +85℃ 额定电流/电压 0.5A/PIN、AC/DC 50V

物理特性上,采用PBT高强度工程塑料外壳,具备耐冲击、抗振动性能;立贴设计无需PCB通孔,直接贴装于电路板表面,节省垂直空间,适配自动化生产流程。

三、设计优势与性能亮点

1. 高密度空间利用

0.5mm间距结合233PIN的2排布局,在极小PCB面积内实现多信号/电力传输,尤其适合智能手机、平板等便携设备的内部模块对接(如主板与显示屏、电池、摄像头),有效压缩设备体积。

2. 可靠连接结构

采用槽型凸-凹对接设计,公端(AXK6A系列)与母端(AXK7A系列)精准匹配,插入时自动定位,减少错位风险;触头为“双触点”结构,提升接触稳定性,典型接触电阻≤20mΩ,支持USB3.0、HDMI 1.4等高速信号传输。

3. 镀金触头的抗环境能力

触头表面镀金处理,可抵抗湿度、盐雾腐蚀(盐雾测试≥48小时),延长产品寿命;同时降低氧化导致的接触不良概率,确保长期信号完整性。

4. 抗振动与机械强度

PBT外壳耐温性优异,配合触头弹性设计,可承受10G/20-2000Hz振动环境,适合工业控制、车载电子(部分场景)等振动工况。

5. 量产适配性

SMD立贴设计支持自动化贴装(贴装精度±0.1mm),与常规SMT产线兼容,提升生产效率,降低人工成本。

四、典型应用场景

1. 消费电子领域

  • 智能手机、平板电脑:主板与显示屏、指纹模块、BMS的连接;
  • 可穿戴设备:智能手表、手环的主板与传感器模块对接。

2. 工业控制领域

  • PLC:控制模块与I/O模块的连接;
  • 工业机器人:伺服驱动器与控制器的信号传输。

3. 通信设备领域

  • 小型基站、路由器:主板与射频模块、电源模块对接;
  • 服务器:内部子板与主板的高速信号连接。

五、选型与使用注意事项

  1. 配对匹配:必须与松下AXK7A系列母端(如AXK7A2337YG)配对,避免公母端不匹配导致失效;
  2. 贴装工艺:0.5mm间距要求贴装误差≤±0.1mm,需高精度贴片机,禁止手工焊接;
  3. 插拔次数:额定插拔100次,过度插拔会降低触头弹性;
  4. 环境限制:避免超温使用,高湿度场景需配合密封处理。

六、总结

AXK6A2337YG以小间距高密度、可靠连接、抗环境能力强为核心优势,完美适配高密度电子设备的连接需求。无论是消费电子的便携性要求,还是工业控制的可靠性要求,均能提供稳定的信号与电力传输方案,是电子设备设计中优化空间、提升性能的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.