WMSIC Electronic Components

PANJIT GS1MI_R2_00101

ModelGS1MI_R2_00101
PackageSMA
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT GS1MI_R2_00101
Type
PANJIT
Minimum package
7500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
GS1MI_R2_00101
Electronic Component
1
Package
SMA
Electronic Component
General Purpose Diode
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0264544566
Current
1A
Diode
1
Current(Ir)
1uA@1000V
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
7500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GS1MI_R2_00101 产品概述

一、产品简介

GS1MI_R2_00101 是强茂(PANJIT)出品的一款高压整流二极管,单只独立封装,采用 SMA 表面贴装封装(等同 DO-214AC)。器件设计用于高电压整流与保护场合,兼顾小体积与高耐压特性,适合自动贴装与批量生产应用。

二、主要电气参数

  • 正向压降 Vf:1.1V @ 1A
  • 直流反向耐压 Vr:1000V
  • 连续整流电流:1A
  • 反向漏电流 Ir:1µA @ 1000V
  • 非重复峰值浪涌电流 Ifsm:30A
  • 工作结温范围:-55℃ 到 +150℃

三、关键特性与优势

  • 高耐压设计(1000V),可胜任高压整流与电荷泵、倍压器等场景。
  • 在额定电流条件下保持较低正向压降(1.1V@1A),有利于降低功耗与发热。
  • 极低的高压漏电(1µA@1000V),适合对漏电敏感的应用。
  • SMA 小型表面贴装,便于高速贴装工艺与空间受限电路板布局。

四、典型应用

  • 高压开关电源的二极管整流与续流。
  • 电压倍增器与高压电源模块。
  • 工业测量、医用设备与电源模块中的保护与整流。
  • 高压脉冲电路及滤波回路(需按脉冲功率能力配合设计)。

五、封装与热管理

SMA(DO-214AC)封装风格紧凑,适合自动贴装。尽管器件额定结温达到 +150℃,在设计时仍需注意 PCB 散热设计与器件热阻:合理铺铜、使用热 vias 及按需降低工作电流以保持结温在安全范围内,避免长期在高温高电流条件下工作。

六、设计与使用建议

  • 高压环境下注意保持足够爬电距离与绝缘设计。
  • 若需更高电流,可考虑并联,但应增加电流均衡措施(不建议直接并联)。
  • 在承受浪涌情形下(Ifsm=30A)做好限流与保护,避免超过短时峰值。
  • 存储与焊接按厂商推荐的回流曲线与湿敏等级要求执行,保证可靠性。

七、采购与选型提示

GS1MI_R2_00101 适合需要 1A 连续整流且要求高耐压、低漏电的小型 SMD 方案。选型时请核对工作电压、峰值浪涌能力与温度环境,必要时咨询强茂技术文件以获取完整封装、机械尺寸与可靠性测试数据。

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