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PANJIT MMSZ5229B_R1_00001
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT MMSZ5229B_R1_00001
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- MMSZ5229B_R1_00001
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- (Zzk)
- 2kΩ
- (Zzt)
- 22Ω
- Electronic Component
- BM0230043986
- Diode
- 1
- Current(Ir)
- 5uA@1V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 4.09V~4.52V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMSZ5229B_R1_00001 产品概述
一、产品简介
MMSZ5229B_R1_00001 是 PANJIT（强茂）出品的一款独立式稳压二极管，标称稳压值 4.3V，适用于小功率电压基准与过压/浪涌钳位场合。器件采用 SOD-123 小封装，体积小、便于表面贴装，适合便携与密集布板应用。
二、主要特性
- 标称稳压：4.3V（规范范围 4.09V～4.52V）
- 反向漏电流：Ir = 5 μA @ 1V（低电压下泄漏小）
- 最大耗散功率：Pd = 500 mW（一定条件下的稳压功率上限）
- 稳态阻抗：Zzt = 22 Ω（表示在测试条件下的动态阻抗）
- 膝部阻抗：Zzk = 2 kΩ（表示接近击穿点时的非线性特性）
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SOD-123，贴片型，带极性标识（阴极环）
三、电气参数要点（设计参考）
- 最大允许电流（近似）：Iz_max ≈ Pd / Vz = 0.5 W / 4.3 V ≈ 116 mA（为理论值，实际使用应留裕量，不建议长期接近此值）。
- 常用偏置电流建议：典型偏置在 1 mA～20 mA 区间，可兼顾稳压精度与功耗。
- 选取限流电阻示例：若 Vin = 12 V，目标 Iz = 10 mA，则 R ≈ (12 − 4.3) / 10 mA ≈ 770 Ω；同时需保证在最坏工况下（Vin最大）不会超过器件的耗散功率。
- 低压下漏电 5 μA 表明在未达击穿时的微弱泄漏，有利于静态功耗控制。
四、典型应用场景
- 低功率电压参考与偏置源（放大器偏置、电平转换）
- 信号线钳位、浪涌保护与电压抑制
- 便携式与消费类电子的次级稳压电路
- 工业控制与通信设备中的局部基准或保护电路
五、使用与设计建议
- 在选择工作电流时，优先保证 Iz 在稳态阻抗 Zzt 所标注测试条件附近，以获得较好稳压性能；避免长期工作在接近 Iz_max 的高电流区。
- 考虑环境温度升高时耗散能力下降，PCB 布局应提供适当散热路径（加大铜箔、减小热阻）。
- SOD-123 封装极性识别明确，阴极通常以带环标记；焊接请遵循厂家回流焊工艺规范以免损伤封装。
- 对于脉冲浪涌或瞬态高能事件，建议在二极管前端增加限流或吸收元件，避免超出瞬态功耗极限。
六、封装与可靠性
SOD-123 小型贴片封装，适合自动贴装、回流焊接。器件额定结温 -55 ℃～+150 ℃，适应宽温应用，但在高温或散热受限的条件下需按 Pd 限制电流并注意长期可靠性。
七、采购与型号识别
- 型号：MMSZ5229B_R1_00001
- 品牌：PANJIT（强茂）
- 封装：SOD-123
购买与选型时，请参考 PANJIT 官方数据手册以获取完整的测试条件、曲线图与封装尺寸，确保设计与实际应用条件一致。
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