Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT US1MWG_R2_000A4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT US1MWG_R2_000A4
- Type
- PANJIT
- Minimum package
- 7500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- US1MWG_R2_000A4
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.096g
- Electronic Component
- 1
- Electronic Component
- BM0264544563
- Current
- 1A
- Current(Ir)
- 10uA
- (Vf)
- 1.7V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
- Voltage Rating(Vr)
- 1kV
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US1MWG_R2_000A4 产品概述
一、产品简介
US1MWG_R2_000A4 是强茂（PANJIT）推出的一款高压整流二极管，封装为SMA。其关键电气参数为：正向压降 Vf = 1.7V（I_F = 1A）；直流反向耐压 Vr = 1000V；额定整流电流 I_O = 1A；反向漏电流 I_R = 10µA（典型条件）；工作结温范围为 −55°C 至 +150°C。该器件适用于对耐压与可靠性有较高要求的整流与保护场合。
二、主要特点
- 高耐压：1000V 的反向耐压适合高压整流应用。
- 低反向漏流：10µA 级别的反向电流有助于降低待机能耗和泄露相关问题。
- 宽工作温度：−55°C 至 +150°C 的结温范围满足严苛环境使用。
- 标准SMA封装：便于表面贴装工艺与自动化生产，体积小且可靠性好。
- 品牌保证：PANJIT（强茂）在功率半导体领域具有良好品质管控。
三、典型应用场景
- 高压整流电路和高压电源模块（如离散整流、整流桥中单元）。
- 开关电源（SMPS）中的次级或初级整流。
- 工业驱动、电池充电器及电源保护电路。
- 极化保护、反向电压保护与高压检测电路等。
四、封装与热管理建议
SMA 封装适合标准回流焊工艺。安装时应保证焊盘有足够铜箔面积以利散热；在高温或高电流工况下应进行适当的电流降额处理。有关焊接温度曲线、焊盘尺寸与热阻等详细参数，请参阅厂方完整数据手册以获得准确设计依据。
五、可靠性与注意事项
- 使用与储存时避免过度潮湿与静电冲击，遵循常规的ESD防护与湿敏等级（MSL）管理要求。
- 设计时应考虑器件的最大结温（150°C）及长期热应力对寿命的影响，必要时加装散热或选用更高规格器件。
- 在高脉冲或冲击电流环境下，建议参考厂方的峰值冲击电流和浪涌能力数据进行验证。
六、选型建议
在最终选型前，请参考完整数据手册中的所有电气特性（如反复峰值耐压、正向特性随温度变化、浪涌电流规格、反向恢复特性等）以确保与具体应用相匹配。如需替代或并联使用，应考虑正向压降、热阻与动态特性的一致性。若需本型号的详细资料或样片，可联系供应商索取原厂datasheet与测试报告。
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