WMSIC Electronic Components

PANJIT MUR4100_AY_100A1

ModelMUR4100_AY_100A1
PackageDO-201AD
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MUR4100_AY_100A1
Type
PANJIT
Minimum package
1250 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MUR4100_AY_100A1
Electronic Component
1
Package
DO-201AD
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
1.12g
Electronic Component
1
Electronic Component
BM0230044372
Current
4A
Diode
1
Current(Ir)
10uA
(Vf)
1.85V@4A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1250

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MUR4100_AY_100A1 产品概述

MUR4100_AY_100A1 是强茂(PANJIT)推出的一款快恢复 / 超快恢复整流二极管,采用 DO-201AD 轴向通孔封装,面向开关电源、整流桥、续流与浪涌吸收等功率电子场合。该器件在高耐压与高速开关环境下表现稳定,适用于需要兼顾耐压、平均整流能力与较短反向恢复时间的应用。

一、主要电气性能概览

  • 正向压降(Vf):1.85 V @ IF = 4 A
  • 直流反向耐压(Vr):1000 V(1 kV)
  • 平均整流电流(IF(AV)):4 A
  • 反向漏电流(Ir):10 μA(典型/规格值,测量条件通常为 Vr 与 25°C)
  • 反向恢复时间(Trr):75 ns
  • 非重复峰值浪涌电流(Ifsm):150 A
  • 工作结温范围:-55 ℃ ~ +150 ℃

这些参数表明 MUR4100_AY_100A1 在高电压与中等电流等级下具备良好折衷:1 kV 的耐压适合高压整流,4 A 的平均整流能力满足多数中功率负载,而 75 ns 的 Trr 则有效降低开关过程中的反向恢复损耗与尖峰,利于开关频率较高的场合使用。

二、封装与热特性

该器件采用 DO-201AD 封装,属于轴向通孔类型,便于手工焊接与传统波峰/回流工艺下的装配。DO-201AD 提供了较好的机械强度与热扩散路径,利于在通孔电路中散热。实际应用中应注意:

  • 合理布局和铜箔面积,以提高散热效率并降低结温。
  • 在高平均电流或高环境温度下,需对 IF(AV) 做适当降额处理;数据手册中通常给出结温与电流的相关曲线,应以手册为准。

三、典型应用场景

  • 开关电源(SMPS)主整流与二极管续流路径
  • 功率转换器、离线电源与逆变器的高压整流
  • 电机驱动与感性负载的续流二极管
  • 浪涌保护、钳位电路与电源桥整流
  • 工业电源、LED 驱动器与充电设备等需要高压与快速恢复的场合

四、设计注意要点

  • 反向恢复与 EMI:75 ns 的反向恢复在多数中高频开关环境下能有效抑制恢复尖峰,但仍会在高 dI/dt 条件下产生电压过冲与电磁干扰。必要时可配合 RC 缓冲、箝位器或软恢复器件以抑制尖峰。
  • 漏电流与温度:反向漏电流会随结温升高而增加,长期工作在高温环境会提高损耗并影响可靠性,应在高温工况下考虑漏电流带来的热应力。
  • 浪涌能力:Ifsm = 150 A(峰值单次浪涌)可应对短时浪涌事件,但不能作为长期运行依据;设计时需保证浪涌条件下的散热与热容能接受该冲击。
  • 电流降额:在靠近最大结温或低散热条件下,应对 IF(AV) 做降额以确保长期可靠性。

五、安装与使用建议

  • 封装为轴向通孔,建议在焊接过程中控制焊接温度与时间,避免长时间过热导致封装或内部焊点损伤。
  • 布局时留出合理的散热面积与走线宽度,必要时在二极管附近设置散热铜箔或散热片。
  • 在高压应用中,注意爬电距离与绝缘安全,布局时保证足够的间隙与通孔绝缘处理。
  • 长时间存放或运输时,避免受潮与机械冲击,按半导体器件的常规储存规范处理。

六、选型与替代建议

MUR4100_AY_100A1 适合在要求 1 kV 耐压、数安培整流且需较快恢复速度的设计中使用。选型时若需:

  • 更低的正向压降或更高的平均电流,应考虑更大封装或肖特基类器件(但肖特基在高压段受限)。
  • 更短的反向恢复时间以减少 EMI,可选用超快恢复(Trr 更短)或软恢复类型的专用器件。
  • 更高的浪涌承受能力,可选用 Ifsm 更高或在并联设计上增加浪涌缓冲。

总结:MUR4100_AY_100A1 以 1 kV 耐压、4 A 平均整流与 75 ns 的反向恢复时间,在通孔封装中为电源与整流应用提供了可靠的性能组合,适合对耐压与开关恢复性能都有要求的中功率场合。具体电路设计与热管理请参考强茂官方数据手册与典型应用电路以获得最佳性能与可靠性。

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