WMSIC Electronic Components

PROD PSTMAA3020-150MB PSTMAA3020

ModelPSTMAA3020-150MB
PackageSMD,3x3mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSTMAA3020-150MB
Type
PROD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSTMAA3020-150MB
Electronic Component
1
Package
SMD,3x3mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.221g
Inductor
15uH
Electronic Component
1
Electronic Component
BM0257711559
Current
1.8A
Resistor(DCR)
260mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSTMAA3020-150MB — PROD(谱罗德)15µH 扁平线一体成型SMD电感 产品概述

一、产品简介

PSTMAA3020-150MB 为谱罗德(PROD)推出的一款小型化扁平线一体成型贴片电感,封装约3×3 mm,专为空间受限且需一定导流能力的电源与滤波应用设计。采用扁平线绕制并一体成型,兼顾磁性能和机械强度,适合自动贴装与回流焊工艺。

二、主要电气参数

  • 电感值:15 µH(标称)
  • 精度:±20%
  • 额定电流:1.8 A(连续工作推荐值)
  • 饱和电流(Isat):2.6 A(磁饱和时电感显著下降)
  • 直流电阻(DCR):约 260 mΩ
  • 封装形式:SMD,3×3 mm,扁平线一体成型

三、产品特性与优劣分析

优点:

  • 体积小、适合高密度PCB布局;
  • 扁平线结构在相同尺寸下有利于减小纹波电流与热量分散;
  • 一体成型提高机械可靠性,利于自动化生产。

权衡点:

  • DCR ~260 mΩ 在大电流场合产生的功耗和发热需考虑,若需更低DCR应选更大封装或不同材质产品;
  • ±20% 精度适合电源滤波和一般功率应用,但对精密谐振回路需注意偏差。

四、选型与设计建议

  • 工作电流通常建议低于额定电流1.8 A以控制温升并保证长期可靠性;短时脉冲可参考Isat 2.6 A但需留安全裕度。
  • 若使用于开关电源,注意电感在工作点的实际电感值下降(由直流偏磁导致),建议在原理图仿真时输入饱和特性曲线或实际测量数据。
  • 对于对功耗敏感的方案,计算I^2·DCR导致的功耗并评估散热路径。

五、PCB布局与焊接要点

  • 尽量缩短与电感相连的电流回路,减小寄生电感与电阻;两个焊盘对称放置,焊盘需保证足够的焊锡端面以获得良好热和电连接。
  • 建议靠近大电流源(如MOSFET、电感入/出端)放置,并配合适当的铜箔散热。
  • 遵循常规无铅回流工艺,避免在装配过程中对器件施加过大机械应力。

六、典型应用

  • 输入或输出LC滤波器、直流-直流降压/升压转换器中的电感元件、功率隔离与纹波抑制、便携设备与通信终端的电源模组等。

七、检验与储存建议

  • 推荐在最终PCB上测量实际电感值、DCR与温升,验证满足系统需求;搬运与贴装过程中避免过度弯曲或挤压。
  • 常规干燥、无腐蚀环境储存,遵循电子元器件静电防护和潮湿敏感器件处理注意事项。

如需进一步数据(如频率特性、温度漂移曲线、饱和特性曲线或推荐封装焊盘尺寸图),可提供样品或询问生产商技术资料表以获得完整可靠的工程数据。

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