WMSIC Electronic Components

RENESAS R5F100FGAFP#10 R5F100FGAFP

ModelR5F100FGAFP#10
Package44-LQFP(10x10)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R5F100FGAFP#10
Type
44-LQFP(10X10)
Unit
Electronic Component
Minimum package
1280 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R5F100FGAFP#10
Electronic Component
1
Package
44-LQFP(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.4g
CPU
16 Bit
CPU
RL78
I / O
31
RAM
12KB
Electronic Component
1
ADC
10bit
EEPROM
8KB
Electronic Component
BM0265023389

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

瑞萨R5F100FGAFP#10 16位单片机产品概述

瑞萨电子(RENESAS)R5F100FGAFP#10是一款基于RL78内核的16位通用单片机(MCU),专为低功耗、高集成度和工业级可靠性设计,适配多种中低端嵌入式应用场景。以下从核心架构、存储资源、外设能力、工作环境及典型应用展开详细概述。

一、核心性能与架构优势

R5F100FGAFP#10采用瑞萨优化的RL78 16位CPU内核,兼顾运算效率与功耗控制:

  • 最大主频达32MHz,16位数据总线支持单周期访问寄存器与内存,指令执行效率远高于8位MCU,可流畅处理PID控制、数据滤波等中等复杂度运算;
  • RL78指令集采用紧凑编码(部分指令仅1字节),大幅减少程序代码量,降低存储占用的同时提升执行速度;
  • 支持多种低功耗模式(如HALT、STOP模式),待机电流可低至μA级,适合电池供电或对功耗敏感的应用。

二、存储资源配置

该型号集成三类非易失/易失存储,满足程序存储与数据交互需求:

  • 程序存储器:128KB FLASH,支持在线串行编程(ISP)与在线调试(ICP),量产阶段无需拆卸芯片即可完成固件更新,适配批量生产流程;
  • 数据存储器:12KB SRAM,足够存储应用程序变量、缓存数据及中断栈,支撑中等规模嵌入式程序运行;
  • 非易失数据存储:8KB EEPROM,擦写寿命≥10万次,适合保存校准参数(如传感器零点)、用户设置(如阈值)等掉电不丢失的数据,无需额外外挂存储芯片。

三、外设与接口能力

集成丰富外设,减少外部组件依赖,降低BOM成本:

  • 通用I/O口:31个双向I/O口,部分引脚支持5V耐压(适配宽电压场景),可复用为外设功能引脚;
  • 模拟外设:10位分辨率ADC,转换速度约1.2μs(@32MHz),支持8~12通道单端/差分输入,精准采集温度、压力、电压等模拟信号;
  • 时钟系统:内置高速振荡器(32MHz)与低速振荡器(32kHz),无需外部晶振即可稳定工作,同时预留外部晶振接口(可选)以提升时钟精度;
  • 串行接口:集成UART(异步串口)、SPI(同步串行)、I2C(两线串行)等常用通信接口,可连接传感器、显示屏、蓝牙模块等外设,实现数据交互与远程控制。

四、工作环境与封装特性

适配恶劣应用场景,兼顾可靠性与设计灵活性:

  • 工作电压:1.6V~5.5V宽电压范围,可直接适配电池供电(如1.5V干电池、3.7V锂电池)或市电降压后的5V电源,无需额外稳压电路;
  • 工作温度:-40℃~+85℃工业级温度范围,满足户外、工业现场、车载辅助设备等高低温环境需求;
  • 封装形式:44-LQFP(10×10mm)贴片封装,引脚间距0.8mm,体积紧凑且便于PCB布局与焊接,适合小型化产品设计(如手持设备、传感器模块)。

五、典型应用场景

结合参数与特性,R5F100FGAFP#10适用于以下场景:

  1. 工业控制:小型电机转速控制、温度/湿度监测模块、PLC扩展单元(工业温度范围+宽电压适配);
  2. 消费电子:智能家居控制器(如智能插座、环境监测仪)、小型家电(如加湿器、咖啡机)(低功耗+紧凑封装);
  3. 车载辅助:车载充电器控制、胎压监测辅助模块(-40~85℃温度范围适配车载环境);
  4. 医疗设备:小型监护仪信号采集、便携式血糖仪数据处理(稳定ADC+低功耗)。

综上,R5F100FGAFP#10凭借RL78内核的低功耗与运算优势、丰富存储与外设、工业级可靠性,成为中低端嵌入式应用的高性价比选择,可快速实现从原型开发到量产的全流程适配。

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