WMSIC Electronic Components

RENESAS R5F100FLAFP#10 R5F100FLAFP

ModelR5F100FLAFP#10
Package44-LQFP(10x10)
BrandRENESAS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
RENESAS R5F100FLAFP#10
Type
44-LQFP(10X10)
Unit
Electronic Component
Minimum package
1280 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RENESAS
Electronic Component
R5F100FLAFP#10
Electronic Component
1
Package
44-LQFP(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.43g
CPU
16 Bit
CPU
RL78
I / O
31
RAM
32KB
Electronic Component
1
ADC
10bit
EEPROM
8KB
Electronic Component
BM0265006893

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

R5F100FLAFP#10 瑞萨RL78系列单片机产品概述

R5F100FLAFP#10是瑞萨电子针对中小规模嵌入式控制场景优化的RL78系列16位单片机,平衡了性能、功耗与成本,具备充足的存储资源、灵活的外设接口及宽温宽压适应性,适用于工业控制、消费电子、智能家居等领域。

一、核心性能参数

该型号采用瑞萨自研的RL78 16位CPU内核,最大主频可达32MHz,相比传统8位单片机性能提升2-3倍,同时保持低功耗特性(典型工作电流仅μA级)。16位架构支持高效指令执行,可快速处理逻辑运算、多任务调度,适合中等复杂度的控制任务,避免了32位单片机的资源浪费。

二、存储体系设计

存储资源充足,满足程序与数据存储需求:

  • 程序存储器:512KB FLASH,支持10万次以上擦写(典型值),可存储完整应用程序、固件升级包,部分区域可配置为数据存储(如EEPROM仿真);
  • 运行内存:32KB RAM,为程序运行提供临时数据空间,支持多变量运算、堆栈操作,满足多数控制算法的内存需求;
  • 掉电存储:8KB EEPROM,无需外部芯片即可保存系统参数、用户设置,掉电后数据可长期保持(典型10年以上),适合需要持久化数据的场景。

三、外设接口配置

集成丰富外设,减少外部元件依赖:

  • 通用I/O:31个可编程I/O引脚,支持输入/输出方向配置,部分引脚复用为外设接口(如UART、SPI);
  • 模拟采集:内置10位ADC,采样率可达1MHz(典型),可采集传感器、电压/电流等模拟信号,精度满足多数工业/消费场景需求;
  • 通信与控制:支持UART、SPI、I2C串行通信接口(复用I/O实现),可连接传感器、显示屏、无线模块;内置定时器/计数器,实现PWM输出、定时中断等功能;
  • 时钟系统:内置32MHz高速振荡器与低速振荡器,无需外部晶振即可稳定工作,降低BOM成本与设计复杂度。

四、工作环境与封装

适应多样化应用场景:

  • 宽电压范围:1.6V~5.5V工作电压,兼容3V电池、5V工业电源,无需额外电压转换电路;
  • 工业级温度:-40℃~+85℃工作温度,可在户外、车间等恶劣环境下稳定运行;
  • 紧凑封装:44-LQFP(10×10mm)封装,引脚间距0.8mm,尺寸小巧,适合小型化产品(如手持设备、嵌入式模块)的PCB布局。

五、典型应用场景

R5F100FLAFP#10的特性使其适用于以下场景:

  1. 工业控制:小型电机控制、传感器数据采集、PLC辅助模块,宽温宽压满足工业环境需求;
  2. 消费电子:智能家居设备(智能插座、传感器节点)、小型家电控制器,低功耗与内置振荡器降低成本;
  3. 医疗电子:小型监护设备、便携式医疗仪器,稳定的模拟采集与存储适合数据记录;
  4. 汽车电子:非车载类配件(如胎压监测辅助模块),宽温特性适配车载环境(部分型号符合AEC-Q100认证)。

该型号延续了RL78系列的低功耗优势,同时提供足够的性能与存储,是中小规模嵌入式应用的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.