Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROQANG RVT2A2R2M0505
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROQANG RVT2A2R2M0505
- Type
- ROQANG
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROQANG
- Electronic Component
- RVT2A2R2M0505
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- SMD,5x5.4mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.354g
- Electronic Component
- 1
- Electronic Component
- BM0264860470
- Electronic Component
- 2000hrs@105℃
- Operating Temperature
- 40℃~+105℃
- Current
- 12mA@120Hz
- Voltage
- 100V
- Capacitor
- 5mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT2A2R2M0505 产品概述
一、产品简介
RVT2A2R2M0505 是 ROQANG（容强）推出的一款小型贴片铝电解电容，额定电压 100V，容值 2.2µF，容差 ±20%，封装尺寸 D5 × L5.4mm（SMD）。该器件针对高电压、小体积的滤波与耦合应用设计，适合对体积和耐压有要求的工业与消费类电源电路。
二、主要特性
- 额定电压：100V，适用于高压直流滤波与能量旁路。
- 容值：2.2µF，容差 ±20%。
- 纹波电流：12mA @ 120Hz（小封装对应的低纹波能力，适合低至中等纹波场合）。
- 工作温度：-40℃ ~ +105℃，适应较宽温度环境。
- 使用寿命：2000 小时 @ 105℃，满足工业级可靠性要求。
- SMD 贴片形式，体积小，利于高密度 PCB 布局。
三、电气与机械规格
- 容值：2.2µF ±20%
- 额定电压：100V DC
- 纹波电流：12mA @ 120Hz
- 封装：SMD，电容体直径 5mm，长度 5.4mm（D5×L5.4mm）
- 工作温度范围：-40℃ ~ +105℃
- 使用寿命：2000hrs @105℃
（注：若需 ESR、ESL、耐压试验及脉冲寿命等详细参数，请参考厂方完整数据手册。）
四、可靠性与寿命说明
本系列在额定温度 105℃ 下经过 2000 小时寿命试验，表现出稳定的容量保持率与洩漏电流特性。建议在实际设计中考虑温升与环境热源对电容寿命的影响：温度每升高 10℃，电解电容寿命会显著缩短，建议留有温度裕度以延长使用寿命。
五、典型应用场景
- 高压直流滤波与稳压电路（如高压电源、HV 模块）。
- 模拟电路耦合/去耦。
- 工业控制、电源模块、测量仪表等对体积和耐压有要求的设备。
- 适用于需要表面贴装工艺且元件高度受限的场合。
六、装配与使用建议
- 焊接：SMD 封装推荐采用厂家指定的回流焊工艺及温度曲线，避免超出最高回流温度和时间以防内部电解液性能退化。
- 布局：尽量靠近噪声源或电源管脚放置以减小走线感抗。避免在高温器件旁边紧贴布局，留出散热空间。
- 极性：为铝电解电容，请注意极性（负极通常有标识），避免反接。
- 存储：存放环境应干燥、避免长期高温，必要时在贴装前按厂家建议回流前预处理。
七、订购与型号说明
RVT2A2R2M0505 系列型号中常包含容值、容差与封装信息（例如 2R2 表示 2.2µF，M 表示 ±20%，0505 表示 5×5.4mm 尺寸）。具体包装、最小订购量、备货与认证信息请向 ROQANG（容强）或授权分销商查询并索取完整数据手册与样品。
如需更详细的电气参数（ESR、漏电流随频率/温度特性、寿命曲线）或可靠性认证数据，可提供需求，我将帮您整理厂方资料要点。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
