Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROQANG RVT1V100M0405
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROQANG RVT1V100M0405
- Type
- ROQANG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROQANG
- Electronic Component
- RVT1V100M0405
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- SMD,4x5.4mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.215g
- Electronic Component
- 1
- Electronic Component
- BM0262715621
- Electronic Component
- 2000hrs@105℃
- Operating Temperature
- 40℃~+105℃
- Current
- 15mA@120Hz
- Voltage
- 35V
- Capacitor
- 4mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT1V100M0405 产品概述
一、产品简介
RVT1V100M0405 为 ROQANG（容强）出品的贴片铝电解电容器，标称电容量 10µF，公差 ±20%，额定电压 35V。小型 SMD 封装（直径 4.0mm × 长度 5.4mm），适用于空间受限的表面贴装应用。该器件针对常规电源滤波、旁路和去耦场景进行优化，兼顾体积与容量比。
二、主要参数
- 电容：10µF ±20%
- 额定电压：35V
- 纹波电流：15mA @ 120Hz（典型）
- 尺寸：D4.0 × L5.4 mm（SMD）
- 工作温度：-40℃ ~ +105℃
- 工作寿命：2000 小时 @ 105℃
- 品牌：ROQANG（容强）
三、特性与优势
- 小尺寸高集成：4×5.4mm 小体积，便于高密度贴片组装。
- 宽温度范围：支持 -40℃ 至 +105℃，适配大多数商用与工业温度环境。
- 可靠性设计：2000 小时 @105℃ 的寿命指标满足中短期高温应力工况。
- 应用广泛：适用于电源滤波、后级去耦、时序与复位电路等需要中小容量电容的位置。
四、典型应用
- 开关电源次级滤波与输出平滑
- PCB 上的旁路和去耦电容
- 工业电路和消费类电子的电源模块
- 电压锥形衰减、复位电路和时基电路的储能元件
五、封装与安装建议
- 极性注意：为铝电解电容，安装时务必确认极性（产品有负极标识），防止反接导致损坏或安全隐患。
- 焊接工艺：推荐按厂方提供的回流焊工艺参数进行焊接，避免重复高温回流与超时高温暴露，以免影响电容寿命与性能。
- PCB 布局：为保证散热与可靠性，贴片周围应留出适度空间，接地平面与散热铜箔布局可优化纹波散热能力。遵循制造商的焊盘建议尺寸与贴片位置公差。
六、可靠性与使用建议
- 额定条件：为获得更长寿命与更低漏电，建议在实际应用中进行一定电压降额（例如在额定电压的 60%–80% 区间内使用），并尽量减小工作温度与纹波应力。
- 寿命管理：2000 小时 @105℃ 表示高温加速条件下的额定寿命，实际在更温和的工作条件下寿命会显著延长。
- 储存与处理：未使用前请按厂方存储要求干燥保存，避免高温高湿与机械损伤；贴装前检查外观与包装完整性。
七、选型与采购建议
在选型时结合电路中允许的最大纹波电流、温度环境与预期寿命进行校核。若系统对长寿命或高纹波能力有更高要求，可考虑更大容量、额定电压更高或专用低阻（ESR）器件。购买时建议提供完整的型号与批号给供应商，并索取器件的规格书与可靠性试验报告以便验收与长期维护。
如需本型号的详细电气特性曲线、焊接回流曲线或替代型号推荐，可提供具体应用场景以便进一步匹配与优化。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
