WMSIC Electronic Components

ROQANG VT1E330M0505

ModelVT1E330M0505
PackageSMD,D5xL5.4mm
BrandROQANG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROQANG VT1E330M0505
Type
ROQANG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROQANG
Electronic Component
VT1E330M0505
Electronic Component
1
Electronic Component
33uF
Package
SMD,D5xL5.4mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.354g
Electronic Component
1
Electronic Component
BM0264860453
Electronic Component
2000hrs@105℃
Operating Temperature
40℃~+105℃
Current
30mA@120Hz
Voltage
25V
Capacitor
5mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VT1E330M0505 产品概述

一、产品简介

VT1E330M0505 是 ROQANG(容强)推出的一款小型贴片铝电解电容,标称容量 33µF,额定电压 25V,公差 ±20%。封装为 SMD,电容体直径 φ5mm,长度 5.4mm(D5×L5.4mm),适用于对体积和高度受限的电源去耦与滤波场合。常温工作范围为 -40℃ 至 +105℃,在 105℃ 下额定寿命为 2000 小时,具有可靠的高温及长期工作能力。

二、主要参数与性能要点

  • 容值:33µF ±20%
  • 额定电压:25V
  • 纹波电流:30mA @ 120Hz(请根据实际工作频率与温升要求留余量)
  • 工作温度:-40℃ ~ +105℃
  • 使用寿命:2000 hrs @ 105℃
  • 封装:SMD,D5×L5.4mm,极性明确(请按标记安装)
    该款电容适合处理中低频纹波与电源旁路,需注意其纹波能力偏小,不适宜承担高纹波电流的开关电源主滤波负荷。

三、典型应用

  • 消费电子设备的稳压输出与去耦(手机配件、便携式设备)
  • 工业控制板、小型通信设备的辅助滤波与旁路
  • 模拟与数字电路的局部电源稳定(注意电流与热管理)
    不建议用于高频大电流的主滤波或替代低 ESR 固态/钽电容的场合。

四、选型与使用建议

  • 电压裕度:建议实际工作电压 ≤ 额定电压的 60%~80%(视可靠性要求而定),以延长寿命并降低漏电与容值衰减。
  • 纹波电流:实际纹波电流应低于额定值并考虑温升,若电路纹波较大,选择额定纹波更高的型号或并联多个电容以分担。
  • 温度与寿命:105℃/2000hrs 为加速老化条件,实际工作在较低温度时寿命会显著增加。
  • 极性与防短:贴片电解为有极性器件,安装时严格按极性标记,否则会引起鼓包或爆破。

五、封装与焊接注意

  • 为保证焊接可靠性,建议采用回流焊工艺并遵循厂商给出的温度曲线;避免长期高峰温度超过推荐值。
  • 贴片封装适合自动贴装与卷带供料(Tape & Reel),焊盘设计应保证良好焊点与应力缓冲。
  • 焊后避免过度机械应力,储存或运输时防止端盖受压以免损伤内部电解介质。

六、可靠性与储存

  • 储存环境建议干燥、避免高温(≤ 40℃)及强光照射,潮湿环境下需回流前进行干燥处理。
  • 长期储存或长期低温环境会有容值和漏电流的轻微变化,使用前可按规范进行预检。
  • 对于关键应用(汽车级或医用等)应进行额外的可靠性验证或选择相应等级产品。

总体而言,VT1E330M0505 以小体积与标准化 SMD 形式,提供了经济可靠的 33µF/25V 铝电解解决方案,适合中低纹波、空间受限的设备电源去耦与滤波使用。选择时请综合评估纹波电流、工作温度与寿命要求,必要时联系供应商获取详细的电气与焊接规范。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.