Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROQANG RVT1E470M0505
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROQANG RVT1E470M0505
- Type
- ROQANG
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROQANG
- Electronic Component
- RVT1E470M0505
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- SMD,5x5.4mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.345g
- Electronic Component
- 1
- Electronic Component
- BM0264860473
- Electronic Component
- 2000hrs@105℃
- Operating Temperature
- 40℃~+105℃
- Current
- 49mA@120Hz
- Voltage
- 25V
- Capacitor
- 5mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT1E470M0505 产品概述
一、产品简介
RVT1E470M0505 为 ROQANG（容强）生产的一款贴片型铝电解电容，额定容量 47μF，额定电压 25V，封装为 SMD（电容体直径 5mm，长度 5.4mm）。该器件针对空间受限的表面贴装应用设计，兼顾容量密度与耐热寿命，适合各类电子设备的滤波、退耦与能量缓冲场合。
二、主要技术参数
- 容值：47μF（±20%）
- 额定电压：25V
- 纹波电流：49mA @ 120Hz
- 电容体尺寸：直径 5mm × 长度 5.4mm（SMD）
- 工作温度：-40℃ ~ +105℃
- 使用寿命：2000 小时 @ 105℃
- 品牌：ROQANG（容强）
三、产品特性与优势
- 小尺寸高容量：5×5.4mm 的紧凑体积适合高密度板级布置。
- 宽温性能：工作温度覆盖工业级范围，可在较宽环境下稳定工作。
- 耐热寿命说明：明确的高温寿命指标（2000hrs@105℃），便于可靠性评估与寿命预测。
- 标准化封装：SMD 形式利于自动贴装与批量生产，提高产线效率。
四、典型应用场景
- 开关电源与稳压模块的输入/输出滤波与退耦。
- 工业控制、电源管理与通信设备中局部能量储备与谐波抑制。
- 空间受限的便携设备或模块化电源单元。
五、封装与焊接建议
- 采用标准 SMD 贴片工艺进行装配，建议按照厂商提供的回流焊曲线进行焊接；如无曲线，应遵循铝电解类器件的一般回流限温与时间要求以避免电解液受损。
- 布局时注意极性标识与贴片方向，避免错误反接。尽量在靠近电源平面处布置，缩短引线长度以降低寄生感抗。
六、可靠性与选型注意
- 纹波电流为 49mA@120Hz，设计时应确保实际工作工况下的交流应力不超过该值，或通过并联/选型提高可承受纹波能力。
- 容值公差 ±20%，对精度要求高的电路应考虑并联或采用容差更小的替代品。
- 铝电解电容应避免长期在额定温度下满载工作，合理降额（例如降低工作电压或改善散热）可显著延长使用寿命。
- 如需更详细的电气特性（如 ESR、等效串联电阻随频率/温度的变化等），请参阅厂家详细数据手册或向供应商索取完整规格书。
如需样品测试、封装文件或回流曲线，可向 ROQANG（容强）经销渠道索取完整资料以便在具体项目中验证与应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
