WMSIC Electronic Components

ROQANG RVE1E331M0810

ModelRVE1E331M0810
PackageSMD,8x10.2mm
BrandROQANG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROQANG RVE1E331M0810
Type
ROQANG
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROQANG
Electronic Component
RVE1E331M0810
Electronic Component
1
Electronic Component
330uF
Package
SMD,8x10.2mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
1.246g
Electronic Component
1
Electronic Component
BM0264860501
Electronic Component
2000hrs@105℃
Operating Temperature
55℃~+105℃
Current
450mA@120Hz
Voltage
25V
Capacitor
8mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RVE1E331M0810 产品概述

一、产品简介

RVE1E331M0810 是 ROQANG(容强)推出的一款贴片型铝电解电容,额定容量 330µF,额定电压 25V,适用于空间受限且需要较大电容值的表面贴装场合。电容体小巧(直径 8mm、长度 10.2mm),为现代消费电子、电源模块和工业控制板提供稳压、滤波与退耦解决方案。

二、主要规格参数

  • 容值:330µF(±20%)
  • 额定电压:25V
  • 纹波电流:450mA @ 120Hz
  • 等效串联电阻(ESR):430mΩ(典型/标称值)
  • 尺寸(电容体):直径 8mm × 长度 10.2mm(SMD)
  • 工作温度范围:-55℃ ~ +105℃
  • 工作寿命:2000 小时 @ 105℃
  • 封装形式:SMD(贴片)
  • 品牌:ROQANG(容强)

三、性能特点

  • 高容值/小体积:330µF 在 D8×L10.2mm 尺寸下实现,适合对空间和容量有双重要求的电路设计。
  • 良好纹波处理能力:450mA@120Hz 的纹波电流能力,适合中低功率稳压与滤波场合。
  • 稳定的 ESR:约 430mΩ 的 ESR 有助于抑制高频噪声并控制纹波损耗,但在高纹波场合仍需评估温升。
  • 宽温特性与高温寿命:工作温度覆盖 -55℃ 至 +105℃,在 105℃ 下保证 2000 小时寿命,适合较严苛的工作环境。

四、典型应用

  • 开关电源输出滤波与旁路(DC-DC、线性稳压器输出)
  • 主板与模块的电源退耦、整流后平滑滤波
  • 音频电源滤波、瞬态抑制场合(需注意 ESR 对音色影响)
  • 工业与通讯设备的中低功率电源回路

五、使用与设计注意事项

  • 极性注意:为铝电解电容,具有极性,正负极须正确安装,反接会导致损坏或安全隐患。
  • 温升管理:在设计中应考虑纹波电流引起的自发热,必要时留出散热通道或使用并联电容分担纹波。
  • 电压降额建议:为延长寿命,建议在设计中对额定电压做适当降额(常见做法为使用额定电压的 50%~80% 作为参考依据,视系统要求调整)。
  • 回流焊与贴装:适配常用 SMT 贴装工艺;具体回流焊曲线和工艺参数应参照容强提供的制造与回流焊资料,以保证可靠性。
  • 储存与预处理:长期储存前请避光、干燥、防潮;如存放时间较长,首次上板使用前可按厂方建议进行“化成”或电气检测。

六、可靠性与寿命

在 +105℃ 环境下标称寿命为 2000 小时,实际使用寿命受工作温度、纹波电流、平均电压与应用环境影响较大。高温、高纹波和过压会显著缩短使用寿命;因此在设计阶段应综合评估负载条件并选用合适的冗余或并联方案以提升可靠性。

七、封装与订购建议

产品为 SMD 贴片封装,封装尺寸 D8×L10.2mm,便于自动化贴装与回流焊工艺。订购时请确认电容容值/容差、额定电压、所需温度等级与寿命指标,并向 ROQANG 或授权代理索取完整的规格书(包括回流曲线、等效电路、寿命试验数据与推荐焊接工艺)以便在量产中保证一致性与可靠性。

如需进一步的电气波形、等效电路模型或在特定电源拓扑中的仿真建议,我可以帮助提供针对性的设计建议和并联/替代元件选型。

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