WMSIC Electronic Components

SHIKUES D882S Transistor D882S

ModelD882S
PackageSOT-23
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES D882S
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
D882S
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0257628049
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
90MHz
Power Dissipation(Pd)
1W
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

D882S 产品概述

一、概述

D882S 是 SHIKUES(时科) 出品的一款 NPN 晶体管,封装为 SOT-23,面向小功率开关与放大应用。器件主要参数:最大集电极电流 Ic=3A,集—射击穿电压 Vceo=30V,耗散功率 Pd=1W,直流电流增益 hFE=30(测试条件 Ic=20mA、VCE=2V),特征频率 fT=90MHz,集电极截止电流 Icbo=1μA,集射极饱和电压 VCE(sat)=500mV,射—基击穿电压 Vebo=5V,工作温度范围 -55℃~+150℃。小型化 SOT-23 封装适合表贴组装、空间受限的应用场景。

二、主要电气特性与工程意义

  • Vceo=30V:适用于低压到中低压电源系统,注意在高压瞬态下需留有裕量并增加保护元件。
  • Ic=3A:标称最大集电极电流,但在 SOT-23 小封装下,持续大电流受限于封装散热与 PCB 布局,应结合热阻与铜箔面积进行热设计并建议在实际应用中有裕量。
  • Pd=1W:热耗散受封装和 PCB 条件影响,建议在评估功耗时参考厂方热阻并对环境温度做降额设计。
  • hFE=30@20mA、2V:在小信号偏流下有中等放大倍数,注意在大电流开关场合通常需外加基极驱动以保证饱和。
  • fT=90MHz:具有较好的高频特性,适合中频放大或高速开关。
  • VCE(sat)=500mV:饱和压较低但非极低,作为功率开关时要考虑损耗。

三、典型应用

  • 小型直流电机驱动、继电器与固态继电器驱动(作为低侧开关)
  • LED 驱动与电流开关
  • 便携电子设备的电源管理与电平转换
  • 中功率音频前级放大器、混合信号开关与中频放大电路

四、设计与使用建议

  • 引脚排列:SOT-23 的具体引脚定义因厂商不同,请以厂方数据手册为准,常见为 Base/Collector/Emitter 排列。
  • 基极限流:设计开关时基极电流应根据期望的饱和比(forced β)计算;若要求低饱和压需较大基极电流,注意不要超过晶体管与驱动器的极限。
  • 热管理:在高 Ic 条件下,通过增大 PCB 铜箔、加热沉或并联器件来降低结温;并参考厂方热阻 θJA 做功率降额。
  • 保护措施:为防止 Vebo、Vceo 或反向电压击穿,应在电路中添加限压、反向保护二极管或 TVS 器件。
  • 寿命与可靠性:工作温度范围广(-55~+150℃),适合工业级环境,但高温长期工作需做额外降额以保证可靠性。

五、封装与采购

SOT-23 小型封装便于表面贴装和自动化生产,适合空间受限与成本敏感的批量应用。采购时注意核对 SHIKUES 的完整数据手册、器件标识与出货规格,重点确认测试条件(如 hFE 的测试电流与 VCE)与最大额定值的应用限制。

六、总结

D882S 以其 30V/3A 的额定能力、90MHz 的频率特性与 SOT-23 的小型封装,适合中低压、中等功率的开关与放大场合。实际设计中应重视热管理、基极驱动与击穿保护,按厂方数据手册进行合理降额与 PCB 布局,以确保长期稳定运行。若需进一步的引脚图、热阻与典型应用电路,请参阅 SHIKUES 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.