WMSIC Electronic Components

SHIKUES SK2371AA

ModelSK2371AA
PackageSOT-23
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES SK2371AA
Type
SHIKUES
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
SK2371AA
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0225764982
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V
Capacitor(Ciss)
553pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SK2371AA 产品概述

一、产品概述

SK2371AA 是时科(SHIKUES)推出的一款小封装 P 沟道功率场效应管(P‑MOSFET),单只器件,适用于中低功率高侧开关、负载切换与反向保护等场景。器件采用 SOT‑23 封装,适配空间受限的便携式与消费电子产品,同时在工业温度范围内稳定工作。工作温度范围宽(-55℃ ~ +150℃),适合苛刻环境应用。

二、主要参数

  • 类型:P 沟道 MOSFET(单个)
  • 漏源耐压 Vdss:100 V
  • 连续漏极电流 Id:2 A
  • 导通电阻 RDS(on):650 mΩ @ VGS = -4.5 V, Id = 1 A
  • 栅极电荷 Qg:4.5 nC @ VGS = 4.5 V(注意 P 沟道驱动为负门压)
  • 输入电容 Ciss:553 pF @ 15 V
  • 反向传输电容 Crss:20 pF @ 15 V
  • 功耗 Pd:1 W(封装及环境依赖)
  • 封装:SOT‑23
  • 工作温度:-55℃ ~ +150℃
  • 品牌:SHIKUES(时科)

三、特点与优势

  • 高压能力:100 V 漏源耐压使其可用于较高电压系统中的高侧开关或保护电路。
  • 小体积:SOT‑23 封装适合便携设备与高密度电路板布局,便于批量生产与自动贴片。
  • 低门电荷:Qg = 4.5 nC(@4.5 V)意味着在中等开关频率下驱动损耗较低,便于与常见驱动电路兼容。
  • 宽温度范围:工业级温度范围使器件在严苛环境下仍能保持可靠性。
  • 适中导通电阻:650 mΩ 在 1 A 工作点下带来可接受的导通损耗,适用于低至中等电流负载。

四、典型应用

  • 电池管理与高侧断开:用于便携设备电源路径断开、反向电流保护与电源选择切换。
  • 负载开关:对小功率直流负载(指示灯、传感器、继电器线圈等)进行高侧控制。
  • 反向保护电路:在需要防止电源接反或倒灌的场合,作为被动保护元件。
  • 小功率 DC/DC 辅助开关:在变换器中用于控制低至中等电流环节或作为开关性质的保护元件。

五、封装与热管理

SOT‑23 封装体积小但散热能力有限。器件标称耗散功率 Pd = 1 W,但实际允许耗散与 PCB 布局、铜面积、环境温度关系密切。建议:

  • 在 PCB 上为器件的 G/S/D 引脚增加铜箔面积,特别是与漏极相连的铜面,用以提高散热能力。
  • 对于持续接近 2 A 的工作电流,应评估结温并必要时降低平均功率或选用更大封装器件。
  • 在高环境温度下参考降额使用,确保结温不超出规格上限。

六、使用建议与注意事项

  • 驱动电压:作为 P 沟道 MOSFET,驱动时需施加相对于源极的负栅压。标称 RDS(on) 在 VGS = -4.5 V 条件下测得,设计驱动回路时请保证足够的负栅压幅值。
  • 开关速度与寄生:输入电容(Ciss = 553 pF)和 Crss(20 pF)会影响开关过渡与栅极驱动脉冲,若用于较高频率应用,应考虑门极阻抗与驱动能力以抑制振荡与开关损耗。
  • 过流与冲击:额定连续电流为 2 A,瞬态和冲击电流应避免超过器件极限,并通过保护电路(限流、保险丝)防止损坏。
  • ESD 与静电:采取常规静电防护措施,避免在无防护条件下操作或装配。

七、封装与采购

  • 封装型号:SOT‑23,适合表面贴装生产线。
  • 包装与数量:单件可供样品与小批量测试;量产时建议向供应商确认卷盘包装与最小起订量。
  • 品牌:SHIKUES(时科),技术支持与资料请咨询厂商或授权代理。

总结:SK2371AA 是一款面向空间受限、需要 100 V 耐压且电流在 2 A 以内的高侧开关与保护类应用的 P 沟道 MOSFET。凭借 SOT‑23 小封装、适中的门电荷与工业级温度范围,在消费电子、便携电源及工业控制中具有良好的适配性。设计时需重视热管理与栅极驱动匹配,以发挥器件最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.