Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI SN74LVC1G32DBVR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) SN74LVC1G32DBVR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- SN74LVC1G32DBVR
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Logic Gate
- Electronic Component
- 74LVC
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Electronic Component
- Electronic Component
- BM0093065208
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.65V~5.5V
- Logic Type
- Gate
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SN74LVC1G32DBVR
SN74LVC1G32DBVR是由德州仪器（Texas Instruments）公司生产的一款高性能逻辑集成电路（IC），属于74LVC系列，专为低电压、宽电源范围的应用而设计。这款或门逻辑电路可在多种电子设备中发挥重要作用，特别适用于对功耗和响应速度有严格要求的数字电路。
主要参数
- 电源电压：SN74LVC1G32DBVR在1.65V至5.5V的电压范围内工作，提供了卓越的灵活性，可以适应多种应用需求。
- 工作温度：该元器件具有-40℃至+125℃的宽温度范围，使其能够在极端环境条件下稳定运行，适合工业、汽车及其他高温应用场合。
- 静态电流：其最大静态电流为10µA，表现出较低的功耗，能够有效延长电池供电设备的工作时间。
- 输出能力：SN74LVC1G32DBVR提供32mA的电流输出能力，能够驱动多数通用负载，适应不同的连接需求。
- 逻辑电平：逻辑电平设置为低0.7V至0.8V，高1.7V至2V，确保其在不同电源电压下均能正确识别逻辑状态。
- 最大传播延迟：该IC在5V、50pF负载条件下的最大传播延迟为4ns，显示出极快的信号切换速度，适合高频应用。
封装信息
SN74LVC1G32DBVR采用SOT-23-5封装，这是一种表面贴装型的封装形式，具有紧凑、轻便的特点。SC-74A和SOT-753等其他对应封装，使得该IC能够在空间受限的电路板上得到广泛使用。其小尺寸在现代电子设计中尤为重要，能够节省空间并提高布局的灵活性。
应用场景
SN74LVC1G32DBVR广泛应用于不同的电子设计和产品中，包括：
- 消费电子：如手机、平板电脑、可穿戴设备等，帮助实现数字信号的逻辑运算。
- 汽车电子：用于传感器数据处理、车载娱乐系统等，多种环境下的可靠工作使其成为汽车应用的理想选择。
- 工业设备：在控制系统中应用于逻辑处理与信号转换，实现高效、可靠的自动化控制。
- 通信设备：用于数据通信和网络设备，快速响应和低功耗特性提升了设备的整体性能。
总结
SN74LVC1G32DBVR作为一款高性能的单通道或门IC，为设计师提供了一个既高效又可靠的解决方案。其工作电压范围、输出能力、传播延迟和宽温度特性使其适用于各种应用，这不仅提升了产品的功能，也保证了设备在多种条件下的稳定性和可靠性。对于追求性能与功耗平衡的设计项目来说，SN74LVC1G32DBVR无疑是一个不可或缺的优选元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
