WMSIC Electronic Components

TI SN74LVC1G86DBVR

TI SN74LVC1G86DBVR
1 / 3

Product image

ModelSN74LVC1G86DBVR
PackageSOT-23-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC1G86DBVR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC1G86DBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.04g
Electronic Component
1
Channel Count
1
Features
Driver
Electronic Component
BM0000287353
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LVC1G86DBVR 产品概述

概述

SN74LVC1G86DBVR 是德州仪器（Texas Instruments）推出的一款单通道异或门（XOR gate）逻辑器件，属于 LVC（低电压CMOS）系列。该器件采用表面贴装（SMD）型封装，尤其适合要求节省空间的高密度电路设计。凭借其广泛的工作电压范围和低功耗特性，SN74LVC1G86DBVR 广泛应用于高速数字电路和低功耗系统中。

技术特性

  • 安装方式：SOT-23-5 表面贴装型封装，适合自动组装以及小型化设备。
  • 逻辑电平：
    • 高电平：1.7V ~ 2.0V
    • 低电平：0.7V ~ 0.8V
  • 供电电压范围：1.65V ~ 5.5V，适应多种数字电源电压。
  • 最大静态电流：10μA，突出了其低功耗优点。
  • 最大传播延迟：在5V和50pF负载条件下，传播延迟达到最大4ns，适合高频率应用。
  • 输出电流能力：能提供高达32mA的输出电流，适用于直接驱动负载。
  • 工作温度范围：-40°C ~ 125°C，适合在极端环境条件下工作。

应用场景

由于其特性，SN74LVC1G86DBVR 适用于多种应用场合，包括但不限于：

  1. 计算机和通信设备：用于实现数据路径中的逻辑函数，提升数据处理和传输效率。
  2. 消费电子：广泛应用于电视、音响等消费电子产品中，控制各种功能开关。
  3. 工业控制系统：在工业自动化设备中，用于信号处理和控制逻辑。
  4. 汽车电子：可用于汽车控制单元和导航系统，提升逻辑运算和信号处理的速度。
  5. 便携式设备：在智能手机、平板等电池供电设备中，由于其低功耗而受到欢迎。

设计考虑

在使用 SN74LVC1G86DBVR 时，设计人员需考虑以下几点：

  • 电源管理：确保供电电压在规定范围内，以保持器件的稳定性和功能。
  • 输入和输出配置：合理设计输入信号的逻辑电平，以防止误触发，同时确保输出负载在32mA范围内。
  • 温度监控：在高温环境下使用时，关注芯片的工作温度，以避免过热损坏。
  • PCB布局：因其封装尺寸小，注意布线和布局，以减少信号干扰和延迟。

总结

SN74LVC1G86DBVR 是一款高度集成的低功耗单通道异或逻辑门，凭借其优秀的性能指标和多功能适用性，成为快速和高效数字电路设计中的理想选择。其来自德州仪器的可靠性和广泛的应用背景，使其在当今需求强烈的电子市场中表现突出。在数字逻辑电路中选用这款器件，可以为您的设计带来更高的灵活性和性能优势。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.