WMSIC Electronic Components

TI SN74LVC1G04DBVR

ModelSN74LVC1G04DBVR
PackageSOT-23-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC1G04DBVR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC1G04DBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Inverter
Electronic Component
74LVC
Electronic Component
0.033g
Electronic Component
1
Electronic Component
1
Channel Count
1
Features
Power Supply
Electronic Component
BM0000282434
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SN74LVC1G04DBVR 反相器

SN74LVC1G04DBVR 是由德州仪器(Texas Instruments)推出的一款高性能单通道反相器,属于74LVC逻辑系列产品。该元件专为低电压、低功耗及高速度应用而设计,适用于各种数字电路,广泛应用于通信、消费电子、计算机以及工业控制等领域。

1. 产品特性

电源电压范围:SN74LVC1G04DBVR运行于1.65V至5.5V的电压范围内,能够满足多种电源系统的需求。这种宽广的工作电压范围使得它在不同的应用环境中都表现出色。

工作温度范围:该器件可以在-40°C 到 +125°C的温度范围内稳定工作,适合在高温及低温环境中使用,确保其在严苛条件下的可靠性。

输出驱动能力:该反相器的输出电流能力为32mA,能驱动多种负载,适合于较高的输出需求。同时,其静态电流最大值仅为10µA,符合现代低功耗设计的要求。

传播延迟:SN74LVC1G04DBVR 在5V供电时,最大传播延迟为3.7ns(50pF负载),这使其在高速数字信号处理应用中表现优异,能够有效地提高系统的整体性能。

逻辑电平:反相器的逻辑电平特性表明,低电平的阈值在0.7V到0.8V之间,而高电平阈值则在1.7V到2V之间,这使得它能够与多种逻辑电平的器件兼容。

封装与安装类型:SN74LVC1G04DBVR采用SOT-23-5封装,适合表面贴装(SMD)技术。这种紧凑的封装设计有助于节省电路板空间,非常适合对于尺寸敏感的应用。

2. 应用场景

由于其优异的性能和灵活的电源范围,SN74LVC1G04DBVR 可广泛应用于多个领域:

  • 通信设备:可以用于信号的反相和增强,提高信号的完整性和传输速率。
  • 消费电子:适合在电视、音响等家用电器内部,从而实现数字逻辑信号的处理。
  • 工业控制:在各种自动化设备中,这款反相器可用于逻辑信号的控制与调节,保障设备的高效运行。
  • 计算机系统:在计算机的逻辑电路中,此元件可用于算法实现和数据处理。

3. 性能优越性

SN74LVC1G04DBVR 的设计充分考虑了现代电子元器件对功耗和速度的双重要求。相较于传统的逻辑器件,其低功耗设计不仅能够减少能耗,还能延长电池供电设备的使用寿命。同时,其高达32mA的输出驱动能力确保了即便在高负载情况下,逻辑电路也能稳定运行。

4. 结论

作为一款高性能的单通道反相器,SN74LVC1G04DBVR 具备灵活的工作电压范围、出色的高低逻辑驱动能力及超低静态功耗等显著特性,适合用于各种高速、低功耗的数字电路设计。无论是在消费电子、通信设备还是工业应用中,其优越的性能都能为设计工程师提供更多可能性,是现代电子设计中的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.