Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI SN74AHCT1G08DBVR
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) SN74AHCT1G08DBVR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- SN74AHCT1G08DBVR
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Logic Gate
- Electronic Component
- 74AHCT
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Electronic Component
- Electronic Component
- BM0264969394
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 4.5V~5.5V
- Logic Type
- and Gate
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74AHCT1G08DBVR 产品概述
产品简介
SN74AHCT1G08DBVR 是德州仪器（Texas Instruments）推出的一款高性能与门 (AND gate) 集成电路，采用表面贴装型（SMD）封装，封装形式为 SOT-23-5。该器件适用于要求严格的逻辑电路应用，具有低功耗和高速度的特点，广泛应用于数字电路、传感器接口和控制系统等领域。
主要性能参数
- 安装类型: 表面贴装型(SMD)，便于自动化焊接和紧凑电路板设计。
- 逻辑电平:
- 高电平阈值（V_H）：2V，确保与大多数数字逻辑电路兼容。
- 低电平阈值（V_L）：0.8V，适应多种低电压逻辑系统。
- 工作电压: 支持供电范围从4.5V至5.5V，具有良好的电压稳定性和适应能力。
- 最大传播延迟: 在5V供电和50pF负载下，最大传播延迟为7.9ns，提供快速的逻辑响应，使其适用于高频信号处理。
- 静态电流: 在最大条件下，静态电流仅为1µA，显著降低功耗，适合移动和便携式设备使用。
- 输出电流能力: 在逻辑高和逻辑低状态下的输出电流均为8mA，满足常见负载要求。
- 工作温度范围: -40°C至125°C的宽温度范围，确保在各种环境条件下可靠运行。
工作原理
SN74AHCT1G08DBVR 的核心功能为与门逻辑运算，其输出仅在所有输入均处于高电平时才为高电平。此类逻辑门常用于信号组合和控制电路中，使其能够实现复杂的逻辑功能。尤其适合以特定输入条件控制多个输出信号的应用。
应用场景
- 数字电路设计: 由于其出色的电气特性，该与门可以组合形成多种数字电路，包括加法器、计数器和其他更复杂的逻辑电路。
- 嵌入式系统: 低静态电流使得该器件尤其适合于需要长时间待机运行的嵌入式应用，如传感器、物联网设备等。
- 数据处理: 在数据选择和传输中，与门能够有效控制数据流，确保仅在特定条件下进行数据处理。
- 控制系统: 由于其高耐温性，可用于工业控制系统和自动化设备，为系统提供稳定的逻辑判断功能。
封装与焊接
SOT-23-5 封装使得 SN74AHCT1G08DBVR 具有良好的散热性能和小尺寸特性，适合高密度电路板设计。产品的表面贴装型也帮助减少电路板上所需的空间，并易于进行高效焊接。推荐使用自动化焊接技术，确保焊接质量和生产效率。
结论
总的来说，SN74AHCT1G08DBVR 作为一种高效能与门集成电路，结合了快速的逻辑处理能力和卓越的电气性能，成为现代电子设计中的理想选择。凭借其宽广的工作电压范围与极低的静态电流消耗，特别适合在低功耗和高温环境下应用。无论在消费电子、工业控制还是通讯系统中，其都展现出可靠性和灵活性，为工程师们设计和实施复杂的逻辑功能提供了坚实的基础。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
