WMSIC Electronic Components

TI SN74LVC1G14DCKR

TI SN74LVC1G14DCKR
1 / 3

Product image

ModelSN74LVC1G14DCKR
PackageSC-70-5
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC1G14DCKR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC1G14DCKR
Electronic Component
1
Package
SC-70-5
Electronic Component
Inverter
Electronic Component
74LVC
Electronic Component
0.033g
Electronic Component
1
Electronic Component
1
Channel Count
1
Features
Power Supply
Electronic Component
BM69414551
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：SN74LVC1G14DCKR

概述 SN74LVC1G14DCKR是一款由德州仪器（Texas Instruments）推出的高性能反相器，其具有施密特触发特性，能够在多种数字电路应用中提供可靠的信号转换。该元器件采用表面贴装型（SMD）封装，在尺寸限制和性能要求日益严格的现代电子设计中尤为重要。

技术特点

  1. 施密特触发特性： SN74LVC1G14DCKR使用施密特触发器设计，能够有效地消除输入信号中的噪声干扰，提供稳健的电平切换。特别是在高速信号传输或者存在电磁干扰的环境中，施密特触发特性显著提高了设计的稳定性和可靠性。

  2. 宽广的供电电压范围： 该部件的供电电压范围为1.65V至5.5V，使其适用于多种供电条件，包括低电压和标准逻辑电平设备。适应性强，适合各种电源管理方案。

  3. 高速性能： 在5V供电时，其最大传播延迟仅为5ns（在负载容性为50pF时），使得其在高速逻辑应用中表现优秀。这一特性使得SN74LVC1G14DCKR非常适合高频应用，比如数据转换和信号重振等场景。

  4. 低功耗： 该器件的静态电流最大值仅为10µA，表明它在无活动状态下能够极大地减少电源消耗，适合便携设备和其他对电池寿命要求高的应用。

  5. 宽工作温度范围： SN74LVC1G14DCKR的工作温度范围从-40°C到125°C，能够适应多种恶劣环境，确保器件在极端条件下仍能可靠工作。

  6. 输出能力： 该器件能提供高达32mA的输出电流，适用于连接各种负载，保证信号的有效传递。

应用领域 SN74LVC1G14DCKR广泛应用于数字电路设计和新兴技术领域。以下是一些具体的应用场景：

  • 消费电子产品：如智能手机、平板电脑和可穿戴设备中，利用其低功耗和小封装特性，优化电池使用寿命。
  • 汽车电子：在汽车的各类控制单元及传感器中，施密特触发特性能够有效处理噪声信号，确保驾驶安全。
  • 工业控制系统：在各种自动化设备与PLC系统中，提供高效可靠的数字信号处理。
  • 通信设备：作为数据转换器或信号整形器，提升数据传输的稳定性和速率。

封装与存储 SN74LVC1G14DCKR采用5脚SC-70封装，具有极为紧凑的体积，适合于空间受限的应用。这种小型封装保证了在高密度电路板设计中的集成能力。

总结 SN74LVC1G14DCKR是一款集高性能、低功耗、宽电压范围及良好抗干扰特性于一身的施密特触发反相器，凭借其卓越的技术指标和广泛的应用场景，成为现代电子设计中不可或缺的基础元器件之一。无论是在消费电子、汽车电子还是工业自动化领域，SN74LVC1G14DCKR都能够提供优质的解决方案，助力产品的可靠性与性能提升。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.